Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
IEEE transactions on electron devices, 2019-05, Vol.66 (5), p.2301-2306
2019

IEEE transactions on electron devices, 2016-07, Vol.63 (7), p.2722-2728
2016

IEEE transactions on electron devices, 2016-01, Vol.63 (1), p.272-279
2016

IEEE transactions on electron devices, 2016-02, Vol.63 (2), p.620-624
2016

IEEE transactions on electron devices, 2001-12, Vol.48 (12), p.2953-2956
2001

2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278), 2002, Vol.2, p.677-680 vol.2
2002

IEEE MTT-S International Microwave Symposium Digest, 2003, 2003, Vol.2, p.837-840 vol.2
2003

IEEE International Integrated Reliability Workshop Final Report, 2004, 2004, p.86-89
2004

IEEE transactions on semiconductor manufacturing, 1990-08, Vol.3 (3), p.145-147
1990

IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005, 2005, p.5-10
2005

IEEE transactions on magnetics, 2004-07, Vol.40 (4), p.3171-3173
2004

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2006, p.235-238
2006

1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389-4), 1994, p.1179-1182 vol.2
1994

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-11
2019
Link zum Volltext

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743), 2004, p.235-238
2004

2004 IEEE International Conference on Semiconductor Electronics, 2004, p.7 pp.
2004

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, p.44-51
2001

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506), 2001, p.235-242
2001

1992 Proceedings 42nd Electronic Components & Technology Conference, 1992, p.930-938
1992

IEEE transactions on device and materials reliability, 2022-03, Vol.22 (1), p.65-72
2022

29th Annual Proceedings Reliability Physics 1991, 1991, p.152-159
1991

IEEE transactions on device and materials reliability, 2013-03, Vol.13 (1), p.301-309
2013


IEEE transactions on electron devices, 2010-04, Vol.57 (4), p.928-938
2010

Journal of microelectromechanical systems, 2006-02, Vol.15 (1), p.120-130
2006
Aktive Filter
Zeitschrift / SerieIeee Transactions On Applied Superconductivity
KollektionIEEE Xplore
ThemaBonding
ThemaPhysical Sciences