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A Laser Doppler Blood Flow Measurement System With a 151.4 dBΩ Gain and 0.05% Nonlinearity for PAD Patients

IEEE sensors journal, 2022-07, Vol.22 (14), p.14196-14204

2022

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Coil Design Optimization of Power Pad in IPT System for Electric Vehicle Applications

IEEE transactions on magnetics, 2018-04, Vol.54 (4), p.1-5

2018

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IEEE_Xplore

A Novel Automatic Probe-to-Pad Alignment Error Correction Approach

IEEE transactions on semiconductor manufacturing, 2022-02, Vol.35 (1), p.146-148

2022

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IEEE_Xplore

In-Vehicle Sensing System to Sense the Ground Pad Configuration in the V2G Mode of EV

IEEE sensors journal, 2023-05, Vol.23 (9), p.1-1

2023

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IEEE_Xplore

Source Pad Design Tradeoffs for a Power TrenchFET

IEEE transactions on semiconductor manufacturing, 2022-08, Vol.35 (3), p.439-445

2022

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IEEE_Xplore

Ferrite Pads Gap Thermal-Magnetic Evaluation and Mitigation for 11.1-kW Wireless Power Transfer

IEEE transactions on magnetics, 2023-11, Vol.59 (11), p.1-1

2023

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IEEE_Xplore

Bonding Pad Over Active Area Layout for Lateral AlGaN/GaN Power HEMTs: A Critical View

IEEE transactions on electron devices, 2019-05, Vol.66 (5), p.2301-2306

2019

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IEEE_Xplore

The Role of Pad Topography in Chemical-Mechanical Polishing

IEEE transactions on semiconductor manufacturing, 2014-08, Vol.27 (3), p.431-442

2014

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IEEE_Xplore

Plasma Charging Behavior of p-MOSFETs With Floating Bond Pads and Its Application to Charging-Safe Bond Pad Design

IEEE transactions on electron devices, 2016-07, Vol.63 (7), p.2722-2728

Lin, Wallace

2016

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IEEE_Xplore

Development and Validation of Fiber Bragg Grating Sensing Pad for Interface Pressure Measurements Within Prosthetic Sockets

IEEE sensors journal, 2016-02, Vol.16 (4), p.965-974

2016

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IEEE_Xplore

Precision Polishing of Single Crystal Diamond (111) Substrates Using a Sol-Gel (SG) Polishing Pad

IEEE transactions on semiconductor manufacturing, 2019-08, Vol.32 (3), p.341-345

2019

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IEEE_Xplore

FBG-Embedded 3-D Printed ABS Sensing Pads: The Impact of Infill Density on Sensitivity and Dynamic Range in Force Sensors

IEEE sensors journal, 2018-10, Vol.18 (20), p.8381-8388

2018

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IEEE_Xplore

Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

IEEE transactions on semiconductor manufacturing, 2018-02, Vol.31 (1), p.144-148

2018

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IEEE_Xplore

An Integrated Characterization Model and Multiobjective Optimization for the Design of an EV Charger's Circular Wireless Power Transfer Pads

IEEE transactions on magnetics, 2017-06, Vol.53 (6), p.1-4

2017

Link zum Volltext
IEEE_Xplore

An Air-Filled Pad With Elastomeric Pillar Array Designed for a Force-Sensing Insole

IEEE sensors journal, 2018-05, Vol.18 (10), p.3968-3976

2018

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IEEE_Xplore

A Shear Sensing Pad, Based on Ferrofluidic Actuation in a Microstructured Optical Fiber

IEEE journal of selected topics in quantum electronics, 2017-03, Vol.23 (2), p.210-216

2017

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IEEE_Xplore

Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures

IEEE transactions on electron devices, 2016-01, Vol.63 (1), p.272-279

Lin, Wallace

2016

Link zum Volltext
IEEE_Xplore

A Soft Robotic Gripper With Neutrally Buoyant Jamming Pads for Gentle Yet Secure Grasping of Underwater Objects

IEEE journal of oceanic engineering, 2022-10, Vol.47 (4), p.975-983

2022

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IEEE_Xplore

Bonding Pad Over Active Structure for Chip Shrinkage of High-Power AlGaN/GaN HFETs

IEEE transactions on electron devices, 2016-02, Vol.63 (2), p.620-624

2016

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IEEE_Xplore

Vulnerability of Copper Pad in BGA Solder Interconnects Under Temperature Cycling

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.679-683

2021

Link zum Volltext
IEEE_Xplore

A Simple and Accurate Pad-Thru-Short Deembedding Method Based on Systematic Analysis for RF Device Characterization

IEEE transactions on electron devices, 2015-01, Vol.62 (1), p.94-101

2015

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IEEE_Xplore

Numerical Simulation of a "Spherical Pad" Slider Flying Over Bit Patterned Media

IEEE transactions on magnetics, 2009-10, Vol.45 (10), p.3616-3619

2009

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IEEE_Xplore

GaN-Based LEDs With GaN \mu-Pillars Around Mesa, Patterned Substrate, and Reflector Under Pads

IEEE photonics technology letters, 2009-11, Vol.21 (22), p.1659-1661

2009

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IEEE_Xplore

Passive Vibration Damping Using Polymer Pads With Microchannel Arrays

Journal of microelectromechanical systems, 2013-06, Vol.22 (3), p.695-707

2013

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IEEE_Xplore

Pattern Optimization for Phyllotactic Fixed Abrasive Pads Based on the Trajectory Method

IEEE transactions on semiconductor manufacturing, 2017-02, Vol.30 (1), p.78-85

2017

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IEEE_Xplore

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A Laser Doppler Blood Flow Measurement System With a 151.4 dBΩ Gain and 0.05% Nonlinearity for PAD Patients

Coil Design Optimization of Power Pad in IPT System for Electric Vehicle Applications

A Novel Automatic Probe-to-Pad Alignment Error Correction Approach

In-Vehicle Sensing System to Sense the Ground Pad Configuration in the V2G Mode of EV

Source Pad Design Tradeoffs for a Power TrenchFET

Ferrite Pads Gap Thermal-Magnetic Evaluation and Mitigation for 11.1-kW Wireless Power Transfer

Bonding Pad Over Active Area Layout for Lateral AlGaN/GaN Power HEMTs: A Critical View

The Role of Pad Topography in Chemical-Mechanical Polishing

Plasma Charging Behavior of p-MOSFETs With Floating Bond Pads and Its Application to Charging-Safe Bond Pad Design

Development and Validation of Fiber Bragg Grating Sensing Pad for Interface Pressure Measurements Within Prosthetic Sockets

Precision Polishing of Single Crystal Diamond (111) Substrates Using a Sol-Gel (SG) Polishing Pad

FBG-Embedded 3-D Printed ABS Sensing Pads: The Impact of Infill Density on Sensitivity and Dynamic Range in Force Sensors

Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

An Integrated Characterization Model and Multiobjective Optimization for the Design of an EV Charger's Circular Wireless Power Transfer Pads

An Air-Filled Pad With Elastomeric Pillar Array Designed for a Force-Sensing Insole

A Shear Sensing Pad, Based on Ferrofluidic Actuation in a Microstructured Optical Fiber

Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures

A Soft Robotic Gripper With Neutrally Buoyant Jamming Pads for Gentle Yet Secure Grasping of Underwater Objects

Bonding Pad Over Active Structure for Chip Shrinkage of High-Power AlGaN/GaN HFETs

Vulnerability of Copper Pad in BGA Solder Interconnects Under Temperature Cycling

A Simple and Accurate Pad-Thru-Short Deembedding Method Based on Systematic Analysis for RF Device Characterization

Numerical Simulation of a "Spherical Pad" Slider Flying Over Bit Patterned Media

GaN-Based LEDs With GaN \mu-Pillars Around Mesa, Patterned Substrate, and Reflector Under Pads

Passive Vibration Damping Using Polymer Pads With Microchannel Arrays

Pattern Optimization for Phyllotactic Fixed Abrasive Pads Based on the Trajectory Method

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