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A First-Principles Study of the SF6 Decomposed Products Adsorbed Over Defective WS2 Monolayer as Promising Gas Sensing Device
IEEE transactions on device and materials reliability, 2019-09, Vol.19 (3), p.473-483
2019
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Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D 2 and N 2 Annealing
IEEE transactions on device and materials reliability, 2023-06, Vol.23 (2), p.276-280
2023
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Interfacial Charge Analysis of Heterogeneous Gate Dielectric-Gate All Around-Tunnel FET for Improved Device Reliability
IEEE transactions on device and materials reliability, 2016-06, Vol.16 (2), p.227-234
2016
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Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device
IEEE transactions on device and materials reliability, 2017-12, Vol.17 (4), p.727-737
2017
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Unveiling T max Inside GaN HEMT Based X-Band Low-Noise Amplifier by Correlating Thermal Simulations and IR Thermographic Measurements
IEEE transactions on device and materials reliability, 2023-03, Vol.23 (1), p.72-79
2023
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Comparative Study of Reliability of Ferroelectric and Anti-Ferroelectric Memories
IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.154-162
2018
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The Novel Structure to Enhancement I on / I off Ratio Based on Field Effect Diode
IEEE transactions on device and materials reliability, 2021-09, Vol.21 (3), p.389-393
2021
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Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
IEEE transactions on device and materials reliability, 2013-03, Vol.13 (1), p.9-17
2013
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Power Cycling Reliability of Power Module: A Survey
IEEE transactions on device and materials reliability, 2016-03, Vol.16 (1), p.80-97
2016
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Guest Editorial TDMR 2021 IIRW Special Section
IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.319-321
2022
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Impact of Interface Trap Charges on Analog/RF and Linearity Performances of Dual-Material Gate-Oxide-Stack Double-Gate TFET
IEEE transactions on device and materials reliability, 2020-06, Vol.20 (2), p.404-412
2020
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Understanding BTI in SiC MOSFETs and Its Impact on Circuit Operation
IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.144-153
2018
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Guest Editorial TDMR IIRW Special Section
IEEE transactions on device and materials reliability, 2024-06, Vol.24 (2), p.159-160
2024
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Design Optimization of Three-Stacked Nanosheet FET From Self-Heating Effects Perspective
IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.396-402
2022
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Effects of Thermo-Mechanical Fatigue and Low Cycle Fatigue Interaction on Performance of Solder Joints
IEEE transactions on device and materials reliability, 2018-12, Vol.18 (4), p.606-612
2018
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Output-Power Enhancement for Hot Spotted Polycrystalline Photovoltaic Solar Cells
IEEE transactions on device and materials reliability, 2018-03, Vol.18 (1), p.37-45
2018
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Critical Insights Into Fast Charging Techniques for Lithium-Ion Batteries in Electric Vehicles
IEEE transactions on device and materials reliability, 2021-03, Vol.21 (1), p.137-152
2021
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Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.240-246
2018
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Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
IEEE transactions on device and materials reliability, 2018-06, Vol.18 (2), p.256-265
2018
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Editorial for New TDMR Editor Byoung Woon Min
IEEE transactions on device and materials reliability, 2020-09, Vol.20 (3), p.486-486
2020
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A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution
IEEE transactions on device and materials reliability, 2016-12, Vol.16 (4), p.667-684
2016
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Improvement of encapsulation technique of organic photovoltaics by UV-curable adhesive
IEEE transactions on device and materials reliability, 2023-06, Vol.23 (2), p.1-1
2023
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Identifying PV Module Mismatch Faults by a Thermography-Based Temperature Distribution Analysis
IEEE transactions on device and materials reliability, 2014-12, Vol.14 (4), p.951-960
2014
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Design and Evaluation of an Efficient Schmitt Trigger-Based Hardened Latch in CNTFET Technology
IEEE transactions on device and materials reliability, 2017-03, Vol.17 (1), p.267-277
2017
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ESD Protection Designs: Topical Overview and Perspective
IEEE transactions on device and materials reliability, 2022-09, Vol.22 (3), p.356-370
2022
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