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Age Hardening of the Al0.5CoCrNiTi0.5 High-Entropy Alloy : High-Entropy Alloys (HEAs)

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.191-195

2014

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Hybrid Monte Carlo/Molecular Dynamics Simulation of a Refractory Metal High Entropy Alloy : High-Entropy Alloys (HEAs)

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.196-200

2014

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In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.80-87

2014

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Tuning the Magnetization Dynamics in Sputtered Co2FeAl0.5Si0.5 Heusler Alloy Thin Film by Gas Pressure

IEEE transactions on magnetics, 2014, Vol.50 (1)

2014

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Enhanced Thermoelectric Performance of Nonstoichiometric Compounds Cu3−xSbSe4 by Cu Deficiencies

Journal of electronic materials, 2014, Vol.43 (6), p.2229-2238

2014

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Interfacial Reactions of High-Bi Alloys on Various Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.155-165

2014

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High-Frequency Inductor Materials : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Journal of electronic materials, 2014, Vol.43 (1), p.117-120

VARGA, L. K

2014

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Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.16-25

2014

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Exchange Bias Effect and Magnetic Properties in La0.7Sr0.3MnO3-NiO Nanocomposite Films

IEEE transactions on magnetics, 2014, Vol.50 (1)

2014

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Ambient Compression-Compression Fatigue Behavior of Magnesium Single Crystal : Deformation, Damage, and Fracture of Light Metals and Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.41-46

QIZHEN LI

2014

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Innovative and Highly Productive Joining Technologies for Multi-Material Lightweight Car Body Structures : Joining and Interface Design

Journal of materials engineering and performance, 2014, Vol.23 (5), p.1515-1523

2014

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Irradiation Resistance of Multicomponent Alloys : High-Entropy Alloys (HEAs)

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.180-183

2014

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The Effect of Indium Additions on Mg-Li and Mg-Li-Al Alloys : Deformation, Damage, and Fracture of Light Metals and Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.55-59

2014

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Mitigation of Sn Whisker Growth by Small Bi Additions : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.1-8

2014

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EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.219-228

2014

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Structure-Property Correlations in CoFe-SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Journal of electronic materials, 2014, Vol.43 (1), p.142-150

2014

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Hydrogen Damage in Superaustenitic 904L Stainless Steels : Diffusion in Solids and Liquids

Journal of materials engineering and performance, 2014, Vol.23 (8), p.2760-2765

2014

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Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy : LEAD-FREE SOLDERS

Journal of electronic materials, 2014, Vol.43 (1), p.33-42

2014

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3rd International Conference of Engineering Against Failure (ICEAF III)

Fatigue & fracture of engineering materials & structures (Print), 2014, Vol.37 (7)

2014

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Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.284-289

2014

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Reinvestigation of Thermoelectric Properties of n- and p-Type Ba8−dAuxSi46−x−y Clathrate

Journal of electronic materials, 2014, Vol.43 (6), p.2430-2434

2014

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Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Journal of electronic materials, 2014, Vol.43 (1), p.204-211

2014

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Predictions of High Strain Rate Failure Modes in Layered Aluminum Composites : Deformation, Damage, and Fracture of Light Metals and Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.60-71

2014

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Electrical and Magnetic Properties of Multiferroic (1-x) BiFeO3-x CoFe2O4 Nanocomposite Thin Films Derived by Sol-gel Process

IEEE transactions on magnetics, 2014, Vol.50 (1)

2014

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Dynamic Micro-Strain Analysis of Ultrafine-Grained Aluminum Magnesium Alloy Using Digital Image Correlation : Deformation, Damage, and Fracture of Light Metals and Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014, Vol.45 (1), p.47-54

2014

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Age Hardening of the Al0.5CoCrNiTi0.5 High-Entropy Alloy : High-Entropy Alloys (HEAs)

Hybrid Monte Carlo/Molecular Dynamics Simulation of a Refractory Metal High Entropy Alloy : High-Entropy Alloys (HEAs)

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers : LEAD-FREE SOLDERS

Tuning the Magnetization Dynamics in Sputtered Co2FeAl0.5Si0.5 Heusler Alloy Thin Film by Gas Pressure

Enhanced Thermoelectric Performance of Nonstoichiometric Compounds Cu3−xSbSe4 by Cu Deficiencies

Interfacial Reactions of High-Bi Alloys on Various Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

High-Frequency Inductor Materials : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications : LEAD-FREE SOLDERS

Exchange Bias Effect and Magnetic Properties in La0.7Sr0.3MnO3-NiO Nanocomposite Films

Ambient Compression-Compression Fatigue Behavior of Magnesium Single Crystal : Deformation, Damage, and Fracture of Light Metals and Alloys

Innovative and Highly Productive Joining Technologies for Multi-Material Lightweight Car Body Structures : Joining and Interface Design

Irradiation Resistance of Multicomponent Alloys : High-Entropy Alloys (HEAs)

The Effect of Indium Additions on Mg-Li and Mg-Li-Al Alloys : Deformation, Damage, and Fracture of Light Metals and Alloys

Mitigation of Sn Whisker Growth by Small Bi Additions : LEAD-FREE SOLDERS

EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Structure-Property Correlations in CoFe-SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques : ADVANCED MATERIALS FOR POWER ELECTRONICS AND POWER CONDITIONING SYSTEMS

Hydrogen Damage in Superaustenitic 904L Stainless Steels : Diffusion in Solids and Liquids

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy : LEAD-FREE SOLDERS

3rd International Conference of Engineering Against Failure (ICEAF III)

Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Reinvestigation of Thermoelectric Properties of n- and p-Type Ba8−dAuxSi46−x−y Clathrate

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS

Predictions of High Strain Rate Failure Modes in Layered Aluminum Composites : Deformation, Damage, and Fracture of Light Metals and Alloys

Electrical and Magnetic Properties of Multiferroic (1-x) BiFeO3-x CoFe2O4 Nanocomposite Thin Films Derived by Sol-gel Process

Dynamic Micro-Strain Analysis of Ultrafine-Grained Aluminum Magnesium Alloy Using Digital Image Correlation : Deformation, Damage, and Fracture of Light Metals and Alloys

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