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A review of lead-free solders for electronics applications

Microelectronics and reliability, 2017-08, Vol.75, p.77-95

2017

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Beyond the lateral flow assay: A review of paper-based microfluidics

Microelectronic engineering, 2019-02, Vol.206, p.45-54

2019

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Nanofabrication by electron beam lithography and its applications: A review

Microelectronic engineering, 2015-03, Vol.135, p.57-72

Chen, Yifang

2015

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Microfluidic platforms for cell cultures and investigations

Microelectronic engineering, 2019-03, Vol.208, p.14-28

2019

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Micropumps and biomedical applications – A review

Microelectronic engineering, 2018-08, Vol.195, p.121-138

2018

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Focused electron beam induced deposition meets materials science

Microelectronic engineering, 2018-01, Vol.185-186, p.9-28

2018

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3D printed microfluidics and microelectronics

Microelectronic engineering, 2018-04, Vol.189, p.52-68

2018

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Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence

Microelectronics and reliability, 2018-08, Vol.87, p.286-320

2018

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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Microelectronics and reliability, 2012-03, Vol.52 (3), p.530-533

2012

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Piezoelectric MEMS vibrational energy harvesters: Advances and outlook

Microelectronic engineering, 2017-11, Vol.183-184, p.23-36

2017

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Failure and reliability analysis of STT-MRAM

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.1848-1852

2012

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Graphene and carbon nanotube (CNT) in MEMS/NEMS applications

Microelectronic engineering, 2015-01, Vol.132, p.192-206

2015

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Review of silver nanoparticle based die attach materials for high power/temperature applications

Microelectronics and reliability, 2017-03, Vol.70, p.1-11

2017

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Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities

Microelectronics and reliability, 2012, Vol.52 (1), p.39-70

Grasser, Tibor

2012

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Hierarchical micro and nano structured, hydrophilic, superhydrophobic and superoleophobic surfaces incorporated in microfluidics, microarrays and lab on chip microsystems

Microelectronic engineering, 2015-01, Vol.132, p.135-155

2015

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Beyond 100 nm resolution in 3D laser lithography — Post processing solutions

Microelectronic engineering, 2018-05, Vol.191, p.25-31

2018

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An overview of through-silicon-via technology and manufacturing challenges

Microelectronic engineering, 2015-03, Vol.135, p.73-106

2015

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Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, p.114412, Article 114412

2021

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On the use of two dimensional hexagonal boron nitride as dielectric

Microelectronic engineering, 2016-09, Vol.163, p.119-133

2016

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Pop-up book MEMS

Journal of micromechanics and microengineering, 2011-11, Vol.21 (11), p.115021

2011

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Silicon electro-optic micro-modulator fabricated in standard CMOS technology as components for all silicon monolithic integrated optoelectronic systems

Journal of micromechanics and microengineering, 2021-05, Vol.31 (5), p.54001

Xu, Kaikai

2021

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Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Microelectronic engineering, 2014-09, Vol.127, p.44-50

2014

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Defect inspection of flip chip solder joints based on non-destructive methods: A review

Microelectronics and reliability, 2020-07, Vol.110, p.113657, Article 113657

2020

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Interacting multiple model particle filter for prognostics of lithium-ion batteries

Microelectronics and reliability, 2017-03, Vol.70, p.59-69

2017

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Revisiting MOSFET threshold voltage extraction methods

Microelectronics and reliability, 2013-01, Vol.53 (1), p.90-104

2013

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A review of lead-free solders for electronics applications

Beyond the lateral flow assay: A review of paper-based microfluidics

Nanofabrication by electron beam lithography and its applications: A review

Microfluidic platforms for cell cultures and investigations

Micropumps and biomedical applications – A review

Focused electron beam induced deposition meets materials science

3D printed microfluidics and microelectronics

Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Piezoelectric MEMS vibrational energy harvesters: Advances and outlook

Failure and reliability analysis of STT-MRAM

Graphene and carbon nanotube (CNT) in MEMS/NEMS applications

Review of silver nanoparticle based die attach materials for high power/temperature applications

Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities

Hierarchical micro and nano structured, hydrophilic, superhydrophobic and superoleophobic surfaces incorporated in microfluidics, microarrays and lab on chip microsystems

Beyond 100 nm resolution in 3D laser lithography — Post processing solutions

An overview of through-silicon-via technology and manufacturing challenges

Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

On the use of two dimensional hexagonal boron nitride as dielectric

Pop-up book MEMS

Silicon electro-optic micro-modulator fabricated in standard CMOS technology as components for all silicon monolithic integrated optoelectronic systems

Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5nm)

Defect inspection of flip chip solder joints based on non-destructive methods: A review

Interacting multiple model particle filter for prognostics of lithium-ion batteries

Revisiting MOSFET threshold voltage extraction methods

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