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반도체 화학기계적 평탄화(CMP)

Kigye chŏnŏl = Journal of the Korean Society of Mechnical Engineers, 2018, Vol.58 (9), p.42-46

이현섭

2018

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CMP의 화학 기계적 균형

Kigye chŏnŏl = Journal of the Korean Society of Mechnical Engineers, 2016, Vol.56 (7), p.36-39

정해도

2016

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Study of Several Silica Properties Influence on Sapphire CMP

Journal of electrical engineering & technology, 2018, Vol.13 (2), p.886-891

2018

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Electrochemical Process for 3D TSV without CMP and Lithographic Processes

2014-03

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침강장-흐름분획법을 이용한 CMP 분말의 입자크기 분석

대한화학회지, 2013, 57(1), , pp.159-164

2013

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The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization

Journal of semiconductor technology and science, 2017, Vol.17 (3), p.319-325

2017

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샤페론 단백질 동시 발현기술을 이용한 수용성 CMP-Neu5Ac Synthetase 생산

한국미생물·생명공학회지, 2014, Vol.42 (2), p.190-193

2014

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Effect of Heat According to Wafer Size on the Removal Rate and Profile in CMP Process

2013-11

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Soluble Production of CMP-Neu5Ac Synthetase by Co-expression of Chaperone Proteins in Escherichia coli

한국미생물·생명공학회지, 2014-06, Vol.42 (2), p.190

2014

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An efficient wavenumber–space–time domain finite-difference modeling of acoustic wave equation for synthesizing CMP gathers

2014-11

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CMP 공정에서 슬러리와 웨이퍼 형상이 SiC 웨이퍼 표면품질에 미치는 영향

한국세라믹학회지, 2011, 48(4), 335, pp.312-315

2011

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Study on the CMP Characteristics of a Copper Passivity Layer Formed by Dipping in an Oxidizer

Journal of the Korean Physical Society, 2011-01, p.120-124

2011

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Effect of Native Oxide on Polycrystalline Silicon CMP

Journal of the Korean Physical Society, 2009-03, p.1077-1081

2009

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Enhancement of CMP pad lifetime for shallow trench isolation process using profile simulation

Current applied physics, 2009-01, p.134-137

2009

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Molecular cloning, phylogenetic analysis, and expression profiling of a grape CMP-sialic acid transporter-like gene induced by phytohormone and abiotic stress

Genes & genomics, 2013-04, p.225-238

2013

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Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion

Corrosion science and technology, 2010-12, Vol.9 (6), p.276-280

2010

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Consumable Approaches of Polysilicon MEMS CMP

Transactions on Electrical and Electronic Materials, 2006, 7(4), , pp.157-162

2006

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A Study of the CMP Effect on the Quality of Thin Silicon Films Crystallized by Using the μ-Czochralski Process

Journal of the Korean Physical Society, 2009-01, p.432-436

2009

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Development of Multiple CMP Monitoring System for Consumable Designs

Transactions on electrical and electronic materials, 2007-02, Vol.8 (1), p.11-14

2007

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Comparative study on osseointegration of calcium metaphosphate (CMP) coated implant to RBM Implant in the femur of rabbits (초)

Maxillofacial plastic and reconstructive surgery, 2010-11, Vol.32 (s1), p.40

2010

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Regular Paper : Physics of the Coefficient of Friction in CMP

Transactions on electrical and electronic materials, 2007-04, Vol.8 (2), p.79

2007

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Physics of the Coefficient of Friction in CMP

Transactions on Electrical and Electronic Materials, 2007, 8(2), , pp.79-83

2007

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Diamond Conditioner Wear Characterization for a Copper CMP Process

Transactions on electrical and electronic materials, 2007-02, Vol.8 (1), p.15-20

2007

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Regular Paper : Consumable Approaches of Polysilicon MEMS CMP

Transactions on electrical and electronic materials, 2006-08, Vol.7 (4), p.157

2006

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Development of Multiple CMP Monitoring Systemfor Consumable Designs

Transactions on Electrical and Electronic Materials, 2007, 8(1), , pp.11-14

2007

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반도체 화학기계적 평탄화(CMP)

CMP의 화학 기계적 균형

Study of Several Silica Properties Influence on Sapphire CMP

Electrochemical Process for 3D TSV without CMP and Lithographic Processes

침강장-흐름분획법을 이용한 CMP 분말의 입자크기 분석

The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization

샤페론 단백질 동시 발현기술을 이용한 수용성 CMP-Neu5Ac Synthetase 생산

Effect of Heat According to Wafer Size on the Removal Rate and Profile in CMP Process

Soluble Production of CMP-Neu5Ac Synthetase by Co-expression of Chaperone Proteins in Escherichia coli

An efficient wavenumber–space–time domain finite-difference modeling of acoustic wave equation for synthesizing CMP gathers

CMP 공정에서 슬러리와 웨이퍼 형상이 SiC 웨이퍼 표면품질에 미치는 영향

Study on the CMP Characteristics of a Copper Passivity Layer Formed by Dipping in an Oxidizer

Effect of Native Oxide on Polycrystalline Silicon CMP

Enhancement of CMP pad lifetime for shallow trench isolation process using profile simulation

Molecular cloning, phylogenetic analysis, and expression profiling of a grape CMP-sialic acid transporter-like gene induced by phytohormone and abiotic stress

Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion

Consumable Approaches of Polysilicon MEMS CMP

A Study of the CMP Effect on the Quality of Thin Silicon Films Crystallized by Using the μ-Czochralski Process

Development of Multiple CMP Monitoring System for Consumable Designs

Comparative study on osseointegration of calcium metaphosphate (CMP) coated implant to RBM Implant in the femur of rabbits (초)

Regular Paper : Physics of the Coefficient of Friction in CMP

Physics of the Coefficient of Friction in CMP

Diamond Conditioner Wear Characterization for a Copper CMP Process

Regular Paper : Consumable Approaches of Polysilicon MEMS CMP

Development of Multiple CMP Monitoring Systemfor Consumable Designs

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