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Electronics letters, 2010-12, Vol.46 (25), p.1699-1700
2010
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IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.1159-1163
2010
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IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.1164-1167
2010
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Proceedings of the Institution of Mechanical Engineers. Part D, Journal of automobile engineering, 2008-09, Vol.222 (9), p.1543-1557
2008
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Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.226-233
1997
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Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.208-216
1997
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Thin solid films, 2008-02, Vol.516 (7), p.1544-1548
2008
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Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.217-225
1997
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Journal of lightwave technology, 1999-01, Vol.17 (1), p.7-13
1999
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IEEE transactions on power delivery, 2009-01, Vol.24 (1), p.416-423
2009
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IEEE transactions on advanced packaging, 2007-02, Vol.30 (1), p.132-141
2007
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Journal of microelectromechanical systems, 2009-10, Vol.18 (5), p.990-997
2009
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IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.2751-2754
2005
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Electronics letters, 2013, Vol.49 (13), p.812-813
2013
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Journal of microelectromechanical systems, 2011-08, Vol.20 (4), p.876-884
2011
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Journal of microelectromechanical systems, 2009-06, Vol.18 (3), p.588-596
2009
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Sensors and actuators. A, Physical, 2002-01, Vol.95 (2), p.259-268
2002
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Journal of materials chemistry, 2009-01, Vol.19 (15), p.2207-2214
2009
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IEEE electron device letters, 2009-07, Vol.30 (7), p.742-744
2009
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Journal of micromechanics and microengineering, 2006-02, Vol.16 (2), p.419-424
2006
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IEEE electron device letters, 2009-05, Vol.30 (5), p.544-546
2009
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IEEE microwave and wireless components letters, 2009-08, Vol.19 (8), p.512-514
2009
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Japanese Journal of Applied Physics, 1997-05, Vol.36 (5A), p.2747-2753
1997
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IEEE transactions on magnetics, 2000-09, Vol.36 (5), p.2857-2859
2000
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Proceedings, IEEE micro electro mechanical systems, 2002, p.479-482
2002
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