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Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.426-431
2023
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Modeling and Analysis of CMOS-based Folded Memristive Crossbar Array for 3D Neuromorphic Integrated Circuits
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.960-966
2023
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Magneto-Assisted Graphene Reinforcement: A New Method to Enhance Nanostructure and Properties of Electrodeposited Copper
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1135-1142
2023
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Environment-Friendly Liquid Metal Coating Material for Patterning Soft and Stretchable Electronics at Low Cost
2023 IEEE 23rd International Conference on Nanotechnology (NANO), 2023, p.1-4
2023
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Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1694-1697
2023
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Reliability and Failure Analysis of Chip-to-Substrate Cu-Pillar Interconnections with Nanoporous-Cu Caps
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.318-323
2023
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Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Optimization of Ferroelectricity in Al-Doped HfO2 Capacitors: Electrical and Endurance Characteristics
2023 Silicon Nanoelectronics Workshop (SNW), 2023, p.49-50
2023
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Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.635-642
2023
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High-Frequency Investigation of Polarization Effects in Nanoscale Hafnium-Based Ferroelectrics
2023 IEEE 23rd International Conference on Nanotechnology (NANO), 2023, p.55-58
2023
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Area-Selective Atomic Layer Deposition of Ruthenium Thin Films by Chemo-Selective Adsorption of Short Alkylating Agents
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Fabrication of flexible and stretchable highly conductive Ag-PDMS tri-layer interconnect and its integration into Li-ion pouch cells
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.450-454
2023
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Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Schottky barrier height and contact resistivity reduction of metal/GaOx/n-GaN structure
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Heterogeneous Radio Chiplet Module for 5G Millimeter Wave Application
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1478-1485
2023
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Reverse Templating Effects of Low-Resistivity Ru ALD on Sputtered Ru
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Development of Copper Thermal Coefficient For Low Temperature Hybrid Bonding
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.342-349
2023
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Process Integration of Photonic Interposer for Chiplet-based 3D Systems
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.5-12
2023
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Design Considerations for Power Delivery Network and Metal-Insulator-Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.985-990
2023
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Thermal and Performance Analysis of Back-side Power Delivery Network beyond 3nm Technology Node
2023 Silicon Nanoelectronics Workshop (SNW), 2023, p.29-30
2023
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Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Improved Switching behaviors of MFM Capacitor with Reduced Ec and Enhanced Pr-V Linearity by Using La-Al co-doped HfO2 Ferroelectric layer
2023 Silicon Nanoelectronics Workshop (SNW), 2023, p.51-52
2023
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Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track Standard Cell Architecture as Scaling Booster
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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Impact of Thermal Annealing and Other Process Parameters on Hybrid Bonding Performance for 3D Advanced Assembly Technology
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1426-1432
2023
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Experimental Study Of Interface & Bulk Defectivity In Ultra-Thin BEOL Dielectrics By Using Low Frequency Noise Spectroscopy
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
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