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A 100 μm diameter capacitive pressure sensor with 50 MPa dynamic range

Journal of micromechanics and microengineering, 2016-04, Vol.26 (4), p.45009

2016

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110 GHz, 110 mW hybrid silicon-lithium niobate Mach-Zehnder modulator

Scientific reports, 2022-11, Vol.12 (1), p.18611-18611, Article 18611

2022

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A 124-plex Microhaplotype Panel Based on Next-generation Sequencing Developed for Forensic Applications

Scientific reports, 2020-02, Vol.10 (1), p.1945-1945, Article 1945

2020

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2-Fluoro-L-Fucose Is a Metabolically Incorporated Inhibitor of Plant Cell Wall Polysaccharide Fucosylation

PloS one, 2015-09, Vol.10 (9), p.e0139091-e0139091

2015

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IL-27 receptor-regulated stress myelopoiesis drives abdominal aortic aneurysm development

Nature communications, 2019-11, Vol.10 (1), p.5046-15, Article 5046

2019

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28nm FDSOI offer for academia and industry

2012 IEEE International SOI Conference (SOI), 2012, p.1-25

Torki, K.

2012

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IEEE_Xplore

2D/2D Heterojunctions for Catalysis

Advanced science, 2019-04, Vol.6 (7), p.1801702-n/a

2019

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2D conjugated microporous polyacetylenes synthesized via halogen-bond-assisted radical solid-phase polymerization for high-performance metal-ion absorbents

Nature communications, 2023-01, Vol.14 (1), p.171-171, Article 171

2023

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2D Organic Materials: Status and Challenges

Advanced science, 2023-03, Vol.10 (7), p.e2203889-n/a

2023

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The second amino acid of alfalfa mosaic virus coat protein is critical for coat protein-mediated protection

Proceedings of the National Academy of Sciences - PNAS, 1991-03, Vol.88 (6), p.2331-2335

1991

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A Second Class I Ribonucleotide Reductase in Enterobacteriaceae: Characterization of the Salmonella typhimurium Enzyme

Proceedings of the National Academy of Sciences - PNAS, 1994-12, Vol.91 (26), p.12892-12896

1994

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The 3.4 GHz BAW RF Filter Based on Single Crystal AlN Resonator for 5G Application

Nanomaterials (Basel, Switzerland), 2022-09, Vol.12 (17), p.3082

2022

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A 3'-5' exonuclease activity embedded in the helicase core domain of Candida albicans Pif1 helicase

Scientific reports, 2017-02, Vol.7 (1), p.42865-42865, Article 42865

2017

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3-D GPR visualization technique integrated with electric resistivity tomography for characterizing near-surface fractures and cavities in limestone

Journal of Taibah University for Science, 2022-12, Vol.16 (1), p.224-239

2022

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3‐Masks‐Processed Sub‐100 nm Amorphous InGaZnO Thin‐Film Transistors for Monolithic 3D Capacitor‐Less Dynamic Random Access Memories

Advanced electronic materials, 2023-08, Vol.9 (8), p.n/a

2023

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The 3'-phosphoadenosine 5'-phosphosulfate transporters, PAPST1 and 2, contribute to the maintenance and differentiation of mouse embryonic stem cells

PloS one, 2009-12, Vol.4 (12), p.e8262-e8262

2009

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A 30-InDel Assay for Genetic Variation and Population Structure Analysis of Chinese Tujia Group

Scientific reports, 2016-11, Vol.6 (1), p.36842-36842, Article 36842

2016

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The +37 kb Cebpa Enhancer Is Critical for Cebpa Myeloid Gene Expression and Contains Functional Sites that Bind SCL, GATA2, C/EBPα, PU.1, and Additional Ets Factors

PloS one, 2015-05, Vol.10 (5), p.e0126385-e0126385

2015

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3C-SiC films on insulated substrates for high-temperature electrostatic-based resonators

Journal of micromechanics and microengineering, 2010-11, Vol.20 (11), p.115007

2010

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A 3C-SiC-on-Insulator-Based Integrated Photonic Platform Using an Anodic Bonding Process with Glass Substrates

Micromachines (Basel), 2023-02, Vol.14 (2), p.399

2023

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3D high-density microelectrode array with optical stimulation and drug delivery for investigating neural circuit dynamics

Nature communications, 2021-01, Vol.12 (1), p.492-492, Article 492

2021

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3D integration of planar crossbar memristive devices with CMOS substrate

Nanotechnology, 2014-10, Vol.25 (40), p.405202-405202

2014

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3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

Microelectronic engineering, 2012-04, Vol.92, p.24-28

2012

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3D NOC for many-core processors

Microelectronics, 2011-12, Vol.42 (12), p.1380-1390

2011

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3D wafer level packaging technology based on the co-planar Au-Si bonding structure

Journal of micromechanics and microengineering, 2019-03, Vol.29 (3), p.35010

2019

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A 100 μm diameter capacitive pressure sensor with 50 MPa dynamic range

110 GHz, 110 mW hybrid silicon-lithium niobate Mach-Zehnder modulator

A 124-plex Microhaplotype Panel Based on Next-generation Sequencing Developed for Forensic Applications

2-Fluoro-L-Fucose Is a Metabolically Incorporated Inhibitor of Plant Cell Wall Polysaccharide Fucosylation

IL-27 receptor-regulated stress myelopoiesis drives abdominal aortic aneurysm development

28nm FDSOI offer for academia and industry

2D/2D Heterojunctions for Catalysis

2D conjugated microporous polyacetylenes synthesized via halogen-bond-assisted radical solid-phase polymerization for high-performance metal-ion absorbents

2D Organic Materials: Status and Challenges

The second amino acid of alfalfa mosaic virus coat protein is critical for coat protein-mediated protection

A Second Class I Ribonucleotide Reductase in Enterobacteriaceae: Characterization of the Salmonella typhimurium Enzyme

The 3.4 GHz BAW RF Filter Based on Single Crystal AlN Resonator for 5G Application

A 3'-5' exonuclease activity embedded in the helicase core domain of Candida albicans Pif1 helicase

3-D GPR visualization technique integrated with electric resistivity tomography for characterizing near-surface fractures and cavities in limestone

3‐Masks‐Processed Sub‐100 nm Amorphous InGaZnO Thin‐Film Transistors for Monolithic 3D Capacitor‐Less Dynamic Random Access Memories

The 3'-phosphoadenosine 5'-phosphosulfate transporters, PAPST1 and 2, contribute to the maintenance and differentiation of mouse embryonic stem cells

A 30-InDel Assay for Genetic Variation and Population Structure Analysis of Chinese Tujia Group

The +37 kb Cebpa Enhancer Is Critical for Cebpa Myeloid Gene Expression and Contains Functional Sites that Bind SCL, GATA2, C/EBPα, PU.1, and Additional Ets Factors

3C-SiC films on insulated substrates for high-temperature electrostatic-based resonators

A 3C-SiC-on-Insulator-Based Integrated Photonic Platform Using an Anodic Bonding Process with Glass Substrates

3D high-density microelectrode array with optical stimulation and drug delivery for investigating neural circuit dynamics

3D integration of planar crossbar memristive devices with CMOS substrate

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

3D NOC for many-core processors

3D wafer level packaging technology based on the co-planar Au-Si bonding structure

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