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Micromachined air-gap structure MEMS acoustic sensor using reproducible high-speed lateral etching and CMP process

Journal of micromechanics and microengineering, 2006-10, Vol.16 (10), p.2071-2076

2006

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The technology of planarizing sacrificial layer on wide cavity for MEMS devices

Journal of micromechanics and microengineering, 2017-12, Vol.27 (12), p.125013

2017

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A new wafer level TSV build-up stacking using oxide bonding

Journal of micromechanics and microengineering, 2013-06, Vol.23 (6), p.65015-12

2013

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Design and fabrication of high performance wafer-level vacuum packaging based on glass-silicon-glass bonding techniques

Journal of micromechanics and microengineering, 2012-12, Vol.22 (12), p.125022-9

2012

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A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications

Journal of micromechanics and microengineering, 2009-10, Vol.19 (10), p.105011-105011 (9)

2009

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Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias

Journal of micromechanics and microengineering, 2012-07, Vol.22 (7), p.74009-8

2012

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A novel linearly tunable MEMS variable capacitor

Journal of micromechanics and microengineering, 2002-01, Vol.12 (1), p.82-86

2002

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RF-MEMS switching devices using vertical comb-drive actuation in the CMOS process

Journal of micromechanics and microengineering, 2010-04, Vol.20 (4), p.045001-045001

2010

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Fabrication of gated SiC vertical edge emitters by chemical mechanical polishing

Journal of micromechanics and microengineering, 1997-06, Vol.7 (2), p.37-43

Busta, Heinz H

1997

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Planarization optimization of RF-MEMS switches with a gold membrane

Journal of micromechanics and microengineering, 2010-06, Vol.20 (6), p.064013-064013

2010

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Integration of AlN with molybdenum electrodes and sacrificial amorphous silicon release using XeF2

Journal of micromechanics and microengineering, 2014-03, Vol.24 (3)

2014

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Fabrication and characterization of a low-cost interposer with an intact insulation layer and ultra-low TSV leakage current

Journal of micromechanics and microengineering, 2018-12, Vol.28 (12), p.125010

2018

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Design, microfabrication and characterization of planarized multilayer atom chips with enhanced heat dissipation

Journal of micromechanics and microengineering, 2011-12, Vol.21 (12), p.125009

2011

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Necessary load for room temperature vacuum sealing

Journal of micromechanics and microengineering, 2005-10, Vol.15 (10), p.S281-S285, Article S281

2005

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A study of thermo-mechanical stress and its impact on through-silicon vias

Journal of micromechanics and microengineering, 2008-07, Vol.18 (7), p.075018-075018 (13)

2008

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Bulk-micromachined, SOI-based half-bridge silicon strain gauges for high pressure applications

Journal of micromechanics and microengineering, 2018-12, Vol.28 (12), p.125004

2018

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Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits

Journal of micromechanics and microengineering, 2017-02, Vol.27 (2), p.25011

2017

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Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique

Journal of micromechanics and microengineering, 2016-10, Vol.26 (11), p.115019

2016

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A cantilever-based resonator for reconfigurable nanomechanical computing

Journal of micromechanics and microengineering, 2021-12, Vol.31 (12), p.124003

2021

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Study on a robust insert-bump (ISB) bonding technique for a 3D package

Journal of micromechanics and microengineering, 2016-07, Vol.26 (7), p.75008

2016

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A microcasted PDMS vacuum pad and its application for stacking thin ceramic layers

Journal of micromechanics and microengineering, 2009-08, Vol.19 (8), p.085008-085008 (10), Article 085008

2009

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Monolithic integration of Si nanowires with metallic electrodes: NEMS resonator and switch applications

Journal of micromechanics and microengineering, 2011-12, Vol.21 (12), p.125018

2011

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Fabrication of thick silicon dioxide sacrificial and isolation blocks in a silicon substrate

Journal of micromechanics and microengineering, 2002-01, Vol.12 (1), p.87-95

2002

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Fusion bonding of silicon nitride surfaces

Journal of micromechanics and microengineering, 2011-12, Vol.21 (12), p.125015

2011

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Wafer level hermetic bonding and packaging using recrystallized parylene

Journal of micromechanics and microengineering, 2023-01, Vol.33 (1), p.14004

2023

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Micromachined air-gap structure MEMS acoustic sensor using reproducible high-speed lateral etching and CMP process

The technology of planarizing sacrificial layer on wide cavity for MEMS devices

A new wafer level TSV build-up stacking using oxide bonding

Design and fabrication of high performance wafer-level vacuum packaging based on glass-silicon-glass bonding techniques

A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications

Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias

A novel linearly tunable MEMS variable capacitor

RF-MEMS switching devices using vertical comb-drive actuation in the CMOS process

Fabrication of gated SiC vertical edge emitters by chemical mechanical polishing

Planarization optimization of RF-MEMS switches with a gold membrane

Integration of AlN with molybdenum electrodes and sacrificial amorphous silicon release using XeF2

Fabrication and characterization of a low-cost interposer with an intact insulation layer and ultra-low TSV leakage current

Design, microfabrication and characterization of planarized multilayer atom chips with enhanced heat dissipation

Necessary load for room temperature vacuum sealing

A study of thermo-mechanical stress and its impact on through-silicon vias

Bulk-micromachined, SOI-based half-bridge silicon strain gauges for high pressure applications

Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits

Fabrication of capacitive micromachined ultrasonic transducers based on adhesive wafer bonding technique

A cantilever-based resonator for reconfigurable nanomechanical computing

Study on a robust insert-bump (ISB) bonding technique for a 3D package

A microcasted PDMS vacuum pad and its application for stacking thin ceramic layers

Monolithic integration of Si nanowires with metallic electrodes: NEMS resonator and switch applications

Fabrication of thick silicon dioxide sacrificial and isolation blocks in a silicon substrate

Fusion bonding of silicon nitride surfaces

Wafer level hermetic bonding and packaging using recrystallized parylene

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