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Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Applied sciences, 2021-08, Vol.11 (16), p.7232

2021

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Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

Materials, 2024-01, Vol.17 (3), p.679

2024

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A Half-Century of CMP

Communications in mathematical physics, 2016-10, Vol.347 (1), p.1-2

Yau, Horng-Tzer

2016

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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

Applied sciences, 2021-04, Vol.11 (8), p.3521

2021

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CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Micromachines (Basel), 2023-01, Vol.14 (1), p.200

2023

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Resource Isolation Method for Program'S Performance on CMP

Journal of physics. Conference series, 2017-10, Vol.910 (1), p.12007

2017

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Pressure calculation using obstacle problem for CMP modeling

Journal of physics. Conference series, 2020-02, Vol.1474 (1), p.12029

2020

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Hybrid CMP Slurry Supply System Using Ionization and Atomization

Applied sciences, 2021-03, Vol.11 (5), p.2217

2021

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Damascene versus subtractive line CMP process for resistive memory crossbars BEOL integration

Micro and Nano Engineering, 2024-06, Vol.23, p.100251, Article 100251

2024

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Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length

Micromachines (Basel), 2024-04, Vol.15 (4), p.549

2024

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CMP-UNet: A Retinal Vessel Segmentation Network Based on Multi-Scale Feature Fusion

Electronics (Basel), 2023-12, Vol.12 (23), p.4743

2023

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Research on influences of contact force in chemical mechanical polishing (CMP) process

AIP advances, 2015-04, Vol.5 (4), p.041305-041305-9

2015

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Ethnomathematics CMP learning-teaching model for improving capabilities in problem solving

Journal of physics. Conference series, 2019-10, Vol.1321 (3), p.32009

2019

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Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Micromachines (Basel), 2020-07, Vol.11 (7), p.705

2020

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Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process

Applied sciences, 2023-03, Vol.13 (6), p.3758

2023

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Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

Frontiers in physics, 2022-02, Vol.9

2022

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Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements

Micromachines (Basel), 2018-10, Vol.9 (11), p.542

2018

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Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate

Nanomaterials (Basel, Switzerland), 2022-11, Vol.12 (21), p.3893

2022

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Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate

Applied sciences, 2019-09, Vol.9 (18), p.3704

2019

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Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes

Micromachines (Basel), 2023-01, Vol.14 (2), p.272

Lee, Hyunseop

2023

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In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

Applied sciences, 2021-08, Vol.11 (15), p.6839

2021

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Router-Integrated Cache Hierarchy Design for Highly Parallel Computing in Efficient CMP Systems

Electronics (Basel), 2019-11, Vol.8 (11), p.1363

2019

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Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

Micromachines (Basel), 2022-10, Vol.13 (10), p.1752

2022

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The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2017, 17(3), 75, pp.319-325

2017

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A Cache Fill and Migration Policy for STT-RAM-Based Multi-Level Hybrid Cache in 3D CMPs

Electronics (Basel), 2019-06, Vol.8 (6), p.639

2019

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Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

A Half-Century of CMP

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Resource Isolation Method for Program'S Performance on CMP

Pressure calculation using obstacle problem for CMP modeling

Hybrid CMP Slurry Supply System Using Ionization and Atomization

Damascene versus subtractive line CMP process for resistive memory crossbars BEOL integration

Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length

CMP-UNet: A Retinal Vessel Segmentation Network Based on Multi-Scale Feature Fusion

Research on influences of contact force in chemical mechanical polishing (CMP) process

Ethnomathematics CMP learning-teaching model for improving capabilities in problem solving

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process

Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements

Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate

Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate

Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes

In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

Router-Integrated Cache Hierarchy Design for Highly Parallel Computing in Efficient CMP Systems

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

The Effect of Inhibitors on the Electrochemical Deposition of Copper Through-silicon Via and its CMP Process Optimization

A Cache Fill and Migration Policy for STT-RAM-Based Multi-Level Hybrid Cache in 3D CMPs

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