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IEEE transactions on components and packaging technologies, 2006-09, Vol.29 (3), p.594-603
2006
- Link zum Volltext
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006, 2006, p.690-696
2006
- Link zum Volltext
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- Circuit Synthesis
- Design Methodology
- Thermal Management Of Electronics
- Acceleration
- Analytical Models
- Boundary Conditions
- Circuit Simulation
- Design
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- Electrical And Electronic Engineering
- Electronic Devices
- Electronic, Optical And Magnetic Materials
- Feedback Loop
- First Order Analysis
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- High-Speed Automated Thermal Layout Design
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- Layer-Based Design Algorithm
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