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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Materials & design, 2018-12, Vol.160, p.1265-1272

2018

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Ag particles for sinter bonding: Flakes or spheres?

Applied physics letters, 2019-06, Vol.114 (25)

2019

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Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics

Journal of materials science, 2019-04, Vol.54 (8), p.6381-6392

2019

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Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

Journal of alloys and compounds, 2018-01, Vol.732, p.240-247

2018

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Communication—Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect

Journal of the Electrochemical Society, 2018-11, Vol.166 (1), p.D3097-D3099

2018

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Synthesis of variously shaped magnetic FeCo nanoparticles and the growth mechanism of FeCo nanocubes

CrystEngComm, 2017, Vol.19 (43), p.6506-6515

2017

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Fast and low-temperature sintering of Ag paste due to nanoparticles formed in situ

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (19), p.18080-18087

2019

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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Nanoscale, 2018-01, Vol.10 (11), p.5254-5263

2018

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Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

ACS applied materials & interfaces, 2019-01, Vol.11 (3), p.3231-3240

2019

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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Materials, 2018-02, Vol.11 (2), p.319

2018

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Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Small (Weinheim an der Bergstrasse, Germany), 2015-09, Vol.11 (33), p.4097-4103

2015

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Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Advanced materials interfaces, 2018-10, Vol.5 (19), p.n/a

2018

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Effects of platinum group metals addition on the precipitation of topologically close-packed phase in Ni-base single crystal superalloys

Journal of alloys and compounds, 2016-06, Vol.671, p.458-464

2016

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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage

Journal of alloys and compounds, 2018-03, Vol.739, p.632-642

2018

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Association between oral health-related quality of life and depressive symptoms in Chinese college students: Fitness Improvement Tactics in Youths (FITYou) project

Health and quality of life outcomes, 2019-06, Vol.17 (1), p.96-8, Article 96

2019

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Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Journal of materials chemistry. C, Materials for optical and electronic devices, 2017, Vol.5 (5), p.1155-1164

2017

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Microstructure and growth mechanism of tin whiskers on RESn3 compounds

Acta materialia, 2013-01, Vol.61 (2), p.589-601

2013

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In situ investigation on the precipitation of topologically close-packed phase in Ni-base single crystal superalloy

Journal of alloys and compounds, 2014-10, Vol.610, p.589-593

2014

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Effect of polyol synthesis on sintering of microsized Ag particles

Microelectronics and reliability, 2019-09, Vol.100-101, p.113340, Article 113340

2019

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The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Journal of alloys and compounds, 2013-02, Vol.550, p.231-238

2013

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Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

Inorganic chemistry, 2019-03, Vol.58 (5), p.3374-3381

2019

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A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Journal of materials science. Materials in electronics, 2017-06, Vol.28 (12), p.8537-8545

2017

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Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

Materials letters. X, 2022-03, Vol.13, p.100124, Article 100124

2022

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Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

ACS applied materials & interfaces, 2017-07, Vol.9 (29), p.24711-24721

2017

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In situ TEM investigation on the precipitation behavior of μ phase in Ni-base single crystal superalloys

Acta materialia, 2016-05, Vol.110, p.268-275

2016

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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Ag particles for sinter bonding: Flakes or spheres?

Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics

Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term stability

Communication—Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect

Synthesis of variously shaped magnetic FeCo nanoparticles and the growth mechanism of FeCo nanocubes

Fast and low-temperature sintering of Ag paste due to nanoparticles formed in situ

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Effects of platinum group metals addition on the precipitation of topologically close-packed phase in Ni-base single crystal superalloys

The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage

Association between oral health-related quality of life and depressive symptoms in Chinese college students: Fitness Improvement Tactics in Youths (FITYou) project

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Microstructure and growth mechanism of tin whiskers on RESn3 compounds

In situ investigation on the precipitation of topologically close-packed phase in Ni-base single crystal superalloy

Effect of polyol synthesis on sintering of microsized Ag particles

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

In situ TEM investigation on the precipitation behavior of μ phase in Ni-base single crystal superalloys

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