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Multi-scale method of Nano(Micro)-CT study on microscopic pore structure of tight sandstone of Yanchang Formation, Ordos Basin

Petroleum exploration and development, 2013-06, Vol.40 (3), p.354-358

2013

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Biomechanics and strain mapping in bone as related to immediately-loaded dental implants

Journal of biomechanics, 2015-09, Vol.48 (12), p.3486-3494

2015

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'We are largely left out': workplace and psychosocial experiences of Australian general practitioners during the initial months of the COVID-19 pandemic

Australian journal of primary health, 2023-02, Vol.29 (1), p.47

2023

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Putting AI to Work: A Practical and Simple Application to Improve 3D X-ray FA

2022 IEEE International Reliability Physics Symposium (IRPS), 2022, p.10C.1-1-10C.1-6

2022

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Organizing a crystallization laboratory

Journal of applied crystallography, 2018-02, Vol.51 (1), p.47-54

2018

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Lithiation-Induced Dilation Mapping in a Lithium-Ion Battery Electrode by 3D X-Ray Microscopy and Digital Volume Correlation

Advanced energy materials, 2014-03, Vol.4 (4), p.np-n/a

2014

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TALLSorts: a T-cell acute lymphoblastic leukemia subtype classifier using RNA-seq expression data

Blood advances, 2023-12, Vol.7 (24), p.7402-7406

2023

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4D Characterization of Deformation Processes in Aluminum Foams: New Dimensions in Materials Engineering

Microscopy and microanalysis, 2014-08, Vol.20 (S3), p.846-847

2014

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3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.206-210

2018

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Batteries: Lithiation-Induced Dilation Mapping in a Lithium-Ion Battery Electrode by 3D X-Ray Microscopy and Digital Volume Correlation (Adv. Energy Mater. 4/2014)

Advanced energy materials, 2014-03, Vol.4 (4), p.n/a

2014

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A Breakthrough in Resolution and Scan Speed: Overcome the Challenges of 3D X-ray Imaging Workflows for Electronics Package Failure Analysis

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2023, p.1-4

2023

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A Deep Learning Reconstruction Technique and Workflow to Enhance 3D X-ray Imaging Resolution and Speed for Electronics Package Failure Analysis

2023 International Conference on Electronics Packaging (ICEP), 2023, p.69-70

2023

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Stem cell factor and granulocyte colony-stimulating factor reduce β-amyloid deposits in the brains of APP/PS1 transgenic mice

Alzheimer's research & therapy, 2011-03, Vol.3 (2), p.8-8

2011

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One-Probe Nanoprobing of Power Devices and Electronic Packages

IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)

2024

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From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2018, p.1-7

2018

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One-Probe Nanoprobing of Power Devices and Electronic Packages

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-5

2023

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From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2022, p.1-5

2022

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Stem cell factor and granulocyte colony-stimulating factor reduce [beta]-amyloid deposits in the brains of APP/PS1 transgenic mice

Alzheimer's research & therapy, 2011-03, Vol.3, p.8

2011

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Non-Destructive 3D Characterization of Application Processor Panel Level Package Used in Galaxy Smartwatch

2019 International Wafer Level Packaging Conference (IWLPC), 2019, p.1-7

2019

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High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-5

2017

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High-resolution 3D X-ray Microscopy for Structural Inspection and Measurement of Semiconductor Package Interconnects

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-4

2019

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High resolution 3D X-ray microscopy for streamlined failure analysis workflow

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.216-219

2016

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Advanced metrology and inspection solutions for a 3D world

2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 2016, p.1-2

2016

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NDT of electronic packages, MEMs, sensors and materials in 3D to submicron resolution

2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1), 2012, p.1-1

2012

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A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias

International Symposium on Microelectronics, 2011-01, Vol.2011 (1), p.17-24

2011

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Multi-scale method of Nano(Micro)-CT study on microscopic pore structure of tight sandstone of Yanchang Formation, Ordos Basin

Biomechanics and strain mapping in bone as related to immediately-loaded dental implants

'We are largely left out': workplace and psychosocial experiences of Australian general practitioners during the initial months of the COVID-19 pandemic

Putting AI to Work: A Practical and Simple Application to Improve 3D X-ray FA

Organizing a crystallization laboratory

Lithiation-Induced Dilation Mapping in a Lithium-Ion Battery Electrode by 3D X-Ray Microscopy and Digital Volume Correlation

TALLSorts: a T-cell acute lymphoblastic leukemia subtype classifier using RNA-seq expression data

4D Characterization of Deformation Processes in Aluminum Foams: New Dimensions in Materials Engineering

3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope

Batteries: Lithiation-Induced Dilation Mapping in a Lithium-Ion Battery Electrode by 3D X-Ray Microscopy and Digital Volume Correlation (Adv. Energy Mater. 4/2014)

A Breakthrough in Resolution and Scan Speed: Overcome the Challenges of 3D X-ray Imaging Workflows for Electronics Package Failure Analysis

A Deep Learning Reconstruction Technique and Workflow to Enhance 3D X-ray Imaging Resolution and Speed for Electronics Package Failure Analysis

Stem cell factor and granulocyte colony-stimulating factor reduce β-amyloid deposits in the brains of APP/PS1 transgenic mice

One-Probe Nanoprobing of Power Devices and Electronic Packages

From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

One-Probe Nanoprobing of Power Devices and Electronic Packages

From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

Stem cell factor and granulocyte colony-stimulating factor reduce [beta]-amyloid deposits in the brains of APP/PS1 transgenic mice

Non-Destructive 3D Characterization of Application Processor Panel Level Package Used in Galaxy Smartwatch

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

High-resolution 3D X-ray Microscopy for Structural Inspection and Measurement of Semiconductor Package Interconnects

High resolution 3D X-ray microscopy for streamlined failure analysis workflow

Advanced metrology and inspection solutions for a 3D world

NDT of electronic packages, MEMs, sensors and materials in 3D to submicron resolution

A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias

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