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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Materials & design, 2018-12, Vol.160, p.1265-1272

2018

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Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics

Journal of materials science, 2019-04, Vol.54 (8), p.6381-6392

2019

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Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Small (Weinheim an der Bergstrasse, Germany), 2015-09, Vol.11 (33), p.4097-4103

2015

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Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Advanced materials interfaces, 2018-10, Vol.5 (19), p.n/a

2018

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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Materials, 2018-02, Vol.11 (2), p.319

2018

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Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

Inorganic chemistry, 2019-03, Vol.58 (5), p.3374-3381

2019

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A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Journal of materials science. Materials in electronics, 2017-06, Vol.28 (12), p.8537-8545

2017

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Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

Materials letters. X, 2022-03, Vol.13, p.100124, Article 100124

2022

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Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

ACS applied materials & interfaces, 2017-07, Vol.9 (29), p.24711-24721

2017

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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging

Journal of alloys and compounds, 2018-04, Vol.740, p.500-509

2018

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In situ TEM investigation on the precipitation behavior of μ phase in Ni-base single crystal superalloys

Acta materialia, 2016-05, Vol.110, p.268-275

2016

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Three-Dimensional Stretchable and Transparent Conductors with Controllable Strain-Distribution Based on Template-Assisted Transfer Printing

ACS applied materials & interfaces, 2019-01, Vol.11 (2), p.2140-2148

2019

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Corrosion-wear behavior of nanocrystalline Fe88Si12 alloy in acid and alkaline solutions

International journal of minerals, metallurgy and materials, 2017, Vol.24 (1), p.75-82

2017

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Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Journal of electronic materials, 2017-08, Vol.46 (8), p.5338-5348

2017

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Study on Silver-plated Molybdenum Interconnected Materials for LEO Solar Cell Array

IOP conference series. Materials Science and Engineering, 2017-09, Vol.229 (1), p.12010

2017

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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

Microelectronics and reliability, 2019-08, Vol.99, p.12-18

2019

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Uniform Regularity for the Isentropic Compressible Magnetohydrodynamic System

Acta Mathematicae Applicatae Sinica, 2022-04, Vol.38 (2), p.410-416

English series, 2022

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The effect of finish layer on the interfacial cracking failure of Au Si bonding

Engineering failure analysis, 2020-09, Vol.115, p.104682, Article 104682

2020

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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package

Journal of materials science & technology, 2018-08, Vol.34 (8), p.1305-1314

2018

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The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles

Materials characterization, 2018-02, Vol.136, p.94-99

2018

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Flame Retardant and Smoke Suppressant of Fe-Organophilic Montmorillonite in Polyvinyl Chloride Nanocomposites

Chinese journal of chemistry, 2008-12, Vol.26 (12), p.2278-2284

2008

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NF-κB induces abnormal centrosome amplification by upregulation of CDK2 in laryngeal squamous cell cancer

International journal of oncology, 2011-10, Vol.39 (4), p.915-924

2011

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Experimental Verifications of Vibration Suppression for a Smart Cantilever Beam with a Modified Velocity Feedback Controller

Shock and vibration, 2014-01, Vol.2014, p.1-9

2014

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Study on Micro-silver Joint Doped with Silicon Carbide Nanowires for Power Electronics

2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023, p.1-4

2023

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Measurement of and Reverse Compensation for Spatial Position Error of Industrial Robots

Journal of testing and evaluation, 2015-09, Vol.43 (5), p.1221-1229

2015

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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics

Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Long-time reliable direct bonding of silver flake paste on Al substrate for power electronic die-attachment

Printable and Flexible Copper–Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging

In situ TEM investigation on the precipitation behavior of μ phase in Ni-base single crystal superalloys

Three-Dimensional Stretchable and Transparent Conductors with Controllable Strain-Distribution Based on Template-Assisted Transfer Printing

Corrosion-wear behavior of nanocrystalline Fe88Si12 alloy in acid and alkaline solutions

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

Study on Silver-plated Molybdenum Interconnected Materials for LEO Solar Cell Array

Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling

Uniform Regularity for the Isentropic Compressible Magnetohydrodynamic System

The effect of finish layer on the interfacial cracking failure of Au Si bonding

Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package

The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles

Flame Retardant and Smoke Suppressant of Fe-Organophilic Montmorillonite in Polyvinyl Chloride Nanocomposites

NF-κB induces abnormal centrosome amplification by upregulation of CDK2 in laryngeal squamous cell cancer

Experimental Verifications of Vibration Suppression for a Smart Cantilever Beam with a Modified Velocity Feedback Controller

Study on Micro-silver Joint Doped with Silicon Carbide Nanowires for Power Electronics

Measurement of and Reverse Compensation for Spatial Position Error of Industrial Robots

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