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Study on Protection Coordination of a Flux-Lock Type SFCL With Over-Current Relay

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.1159-1163

2010

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IEEE_Xplore

Dry release for surface micromachining with HF vapor-phase etching

Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.226-233

1997

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IEEE_Xplore

Package-Level Integrated LTCC Antenna for RF Package Application

IEEE transactions on advanced packaging, 2007-02, Vol.30 (1), p.132-141

2007

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IEEE_Xplore

Fabrication of YBCO superconducting tape by metal organic chemical vapor deposition method

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.2751-2754

2005

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IEEE_Xplore

Fabrication of Very-High-Aspect-Ratio Micro Metal Posts and Gratings by Photoelectrochemical Etching and Electroplating

Journal of microelectromechanical systems, 2011-08, Vol.20 (4), p.876-884

2011

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IEEE_Xplore

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

Journal of microelectromechanical systems, 2009-06, Vol.18 (3), p.588-596

2009

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IEEE_Xplore

Electrowetting and electrowetting-on-dielectric for microscale liquid handling

Sensors and actuators. A, Physical, 2002, Vol.95 (2), p.259-268

2002

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Electrically bistable nonvolatile switching devices fabricated with a high performance polyimide bearing diphenylcarbamyl moieties

Journal of materials chemistry, 2009-01, Vol.19 (15), p.2207-2214

2009

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Fully Depleted Polysilicon TFTs for Capacitorless 1T-DRAM

IEEE electron device letters, 2009-07, Vol.30 (7), p.742-744

2009

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IEEE_Xplore

A degassing plate with hydrophobic bubble capture and distributed venting for microfluidic devices

Journal of micromechanics and microengineering, 2006-02, Vol.16 (2), p.419-424

2006

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Gate-to-Source/Drain Nonoverlap Device for Soft-Program Immune Unified RAM (URAM)

IEEE electron device letters, 2009-05, Vol.30 (5), p.544-546

2009

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IEEE_Xplore

A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator

IEEE microwave and wireless components letters, 2009-08, Vol.19 (8), p.512-514

2009

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IEEE_Xplore

Etching effects on ferroelectric capacitors with multilayered electrodes

Japanese Journal of Applied Physics, 1997-05, Vol.36 (5A), p.2747-2753

1997

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MR characteristics of synthetic ferrimagnet based spin-valves with different pinning layer thickness ratios

IEEE transactions on magnetics, 2000-09, Vol.36 (5), p.2857-2859

2000

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IEEE_Xplore

Nanostructured surfaces for dramatic reduction of flow resistance in droplet-based microfluidics

Proceedings, IEEE micro electro mechanical systems, 2002, p.479-482

2002

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IEEE_Xplore

Electrostatic Side-Drive Rotary Stage on Liquid-Ring Bearing

Journal of microelectromechanical systems, 2014-02, Vol.23 (1), p.147-156

2014

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IEEE_Xplore

Dissolution and resolidification of SmBa2Cu3O7-y seed during top seeded melt texturing of YBa2Cu3O7-y

IEEE transactions on applied superconductivity, 1999-06, Vol.9 (2), p.2097-2100

1999

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Control of growth rate and texture formation of YBa2Cu3O7-y single-domained crystal by applying two-step undercooling in TSMG

IEEE transactions on applied superconductivity, 1999-06, Vol.9 (2), p.2093-2096

1999

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A study on the fabrication of a multigate/multichannel polysilicon thin film transistor

Japanese Journal of Applied Physics, 1997-03, Vol.36 (3B), p.1428-1432

1997

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Evaluation of double Spacer local oxidation of silicon (LOCOS) isolation process for sub-quarter micron design rule

Japanese Journal of Applied Physics, 1997-03, Vol.36 (3B), p.1433-1438

1997

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Mechanical properties of aerogel-like thin films used for MEMS

Journal of micromechanics and microengineering, 2004-05, Vol.14 (5), p.681-686

2004

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Lateral polysilicon microrelays with a mercury microdrop contact : Special section on micromachining

IEEE transactions on industrial electronics (1982), 1998, Vol.45 (6), p.854-860

1998

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Preparation of YBa2Cu3Ox film deposited on various substrates by MOCVD processing

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.2767-2770

2005

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Flow control by using high-aspect-ratio, in-plane microactuators: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998

Sensors and actuators. A. Physical., 1999, Vol.73 (1-2), p.169-175

1999

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Mesoscale actuator device : micro interlocking mechanism to transfer macro load: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998

Sensors and actuators. A. Physical., 1999, Vol.73 (1-2), p.30-36

1999

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Study on Protection Coordination of a Flux-Lock Type SFCL With Over-Current Relay

Dry release for surface micromachining with HF vapor-phase etching

Package-Level Integrated LTCC Antenna for RF Package Application

Fabrication of YBCO superconducting tape by metal organic chemical vapor deposition method

Fabrication of Very-High-Aspect-Ratio Micro Metal Posts and Gratings by Photoelectrochemical Etching and Electroplating

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

Electrowetting and electrowetting-on-dielectric for microscale liquid handling

Electrically bistable nonvolatile switching devices fabricated with a high performance polyimide bearing diphenylcarbamyl moieties

Fully Depleted Polysilicon TFTs for Capacitorless 1T-DRAM

A degassing plate with hydrophobic bubble capture and distributed venting for microfluidic devices

Gate-to-Source/Drain Nonoverlap Device for Soft-Program Immune Unified RAM (URAM)

A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator

Etching effects on ferroelectric capacitors with multilayered electrodes

MR characteristics of synthetic ferrimagnet based spin-valves with different pinning layer thickness ratios

Nanostructured surfaces for dramatic reduction of flow resistance in droplet-based microfluidics

Electrostatic Side-Drive Rotary Stage on Liquid-Ring Bearing

Dissolution and resolidification of SmBa2Cu3O7-y seed during top seeded melt texturing of YBa2Cu3O7-y

Control of growth rate and texture formation of YBa2Cu3O7-y single-domained crystal by applying two-step undercooling in TSMG

A study on the fabrication of a multigate/multichannel polysilicon thin film transistor

Evaluation of double Spacer local oxidation of silicon (LOCOS) isolation process for sub-quarter micron design rule

Mechanical properties of aerogel-like thin films used for MEMS

Lateral polysilicon microrelays with a mercury microdrop contact : Special section on micromachining

Preparation of YBa2Cu3Ox film deposited on various substrates by MOCVD processing

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