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RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis

Applied surface science, 2020-03, Vol.506, p.144668, Article 144668

2020

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LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA

BMC cancer, 2021-10, Vol.21 (1), p.1145-1145, Article 1145

2021

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Effect of photocatalytic oxidation technology on GaN CMP

Applied surface science, 2016-01, Vol.361, p.18-24

2016

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Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing

Electronic Materials Letters, 2023, 19(6), , pp.580-587

2023

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Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS

Hydrology and earth system sciences, 2017-06, Vol.21 (6), p.2905-2922

2017

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Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Micromachines (Basel), 2023-11, Vol.14 (11), p.2053

2023

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Chemical effects on the tribological behavior during copper chemical mechanical planarization

Materials chemistry and physics, 2015-03, Vol.153, p.48-53

2015

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Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry

Applied surface science, 2014-11, Vol.320, p.531-537

2014

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Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters

Advanced science, 2023-12, Vol.10 (34), p.e2304990-n/a

2023

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Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization

Microelectronic engineering, 2016-02, Vol.151, p.38-46

2016

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Kinematic analysis of in situ measurement during chemical mechanical planarization process

Review of scientific instruments, 2015-10, Vol.86 (10)

2015

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Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling

Applied surface science, 2013-01, Vol.265, p.764-770

2013

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Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition

The Visual computer, 2015-10, Vol.31 (10), p.1383-1394

2015

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Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

IEEE transactions on semiconductor manufacturing, 2013-11, Vol.26 (4), p.556-563

2013

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Numerical and experimental investigation on multi-zone chemical mechanical planarization

Microelectronic engineering, 2011-11, Vol.88 (11), p.3327-3332

2011

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Correlation Analysis of Erectile Dysfunction with Lower Urinary Tract Symptoms (LUTS) Degree and Clinical Features in LUTS Patients

Iranian journal of public health, 2018-05, Vol.47 (5), p.658-665

2018

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Effect of a Cu seed layer on electroplated Cu film

Microelectronic engineering, 2013-05, Vol.105, p.18-24

2013

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Size-reduction and band-broadening design technique of uniplanar hybrid ring coupler using phase inverter for M(H)MIC's

IEEE transactions on microwave theory and techniques, 1999-02, Vol.47 (2), p.198-206

1999

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Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing

IEEE transactions on semiconductor manufacturing, 2012-08, Vol.25 (3), p.502-510

2012

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An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data

Knowledge-based systems, 2022-01, Vol.235, p.107652, Article 107652

2022

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Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process

IEEE transactions on semiconductor manufacturing, 2017-05, Vol.30 (2), p.143-154

2017

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Extracting Refined Low-Rank Features of Robust PCA for Human Action Recognition

Arabian Journal for Science and Engineering, 2015-05, Vol.40 (5), p.1427-1441

2015

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Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer

Microelectronic engineering, 2013-12, Vol.112, p.5-9

2013

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Metal thickness measurement system based on a double-coil eddy-current method with characteristic ratio detection

IEEE transactions on industrial electronics (1982), 2023-12, Vol.70 (12), p.1-9

2023

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In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone

Microelectronic engineering, 2013-08, Vol.108, p.66-70

2013

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RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis

LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA

Effect of photocatalytic oxidation technology on GaN CMP

Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing

Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Chemical effects on the tribological behavior during copper chemical mechanical planarization

Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry

Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters

Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization

Kinematic analysis of in situ measurement during chemical mechanical planarization process

Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling

Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition

Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

Numerical and experimental investigation on multi-zone chemical mechanical planarization

Correlation Analysis of Erectile Dysfunction with Lower Urinary Tract Symptoms (LUTS) Degree and Clinical Features in LUTS Patients

Effect of a Cu seed layer on electroplated Cu film

Size-reduction and band-broadening design technique of uniplanar hybrid ring coupler using phase inverter for M(H)MIC's

Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing

An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data

Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process

Extracting Refined Low-Rank Features of Robust PCA for Human Action Recognition

Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer

Metal thickness measurement system based on a double-coil eddy-current method with characteristic ratio detection

In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone

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