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The future of microprocessors
Communications of the ACM, 2011-05, Vol.54 (5), p.67-77
2011
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TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
Communications of the ACM, 2014-01, Vol.57 (1), p.107-115
2014
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High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs
IEEE design and test, 2016-04, Vol.33 (2), p.17-29
2016
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EM-Based On-Chip Aging Sensor for Detection of Recycled ICs
IEEE design and test, 2016-10, Vol.33 (5), p.56-64
2016
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Nash equilibria of packet forwarding strategies in wireless ad hoc networks
IEEE transactions on mobile computing, 2006-05, Vol.5 (5), p.463-476
2006
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Joint Interference Coordination and Load Balancing for OFDMA Multihop Cellular Networks
IEEE transactions on mobile computing, 2014-01, Vol.13 (1), p.89-101
2014
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Protection Against Hardware Trojan Attacks: Towards a Comprehensive Solution
IEEE design and test, 2013-06, Vol.30 (3), p.6-17
2013
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How Secure Are Printed Circuit Boards Against Trojan Attacks?
IEEE design and test, 2015-04, Vol.32 (2), p.7-16
2015
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A Clock Sweeping Technique for Detecting Hardware Trojans Impacting Circuits Delay
IEEE design and test, 2013-04, Vol.30 (2), p.26-34
2013
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The Internet of Things on Its Edge: Trends Toward Its Tipping Point
IEEE consumer electronics magazine, 2018-01, Vol.7 (1), p.77-87
2018
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Secure Interposer-Based Heterogeneous Integration
IEEE design and test, 2022-12, Vol.39 (6), p.156-164
2022
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A Survey on Security Threats and Countermeasures in IEEE Test Standards
IEEE design and test, 2019-06, Vol.36 (3), p.95-116
2019
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Wavelets for computer graphics: a primer. 2
IEEE computer graphics and applications, 1995-07, Vol.15 (4), p.75-85
1995
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PLL-Assisted Timing Circuit for Accurate TSV Leakage Binning
IEEE design and test, 2014-08, Vol.31 (4), p.36-42
2014
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Micropipelines
Communications of the ACM, 1989-06, Vol.32 (6), p.720-738
1989
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In Vitro Long-Term Performance Evaluation and Improvement in the Response Time of CMOS-Based Implantable Glucose Sensors
IEEE design and test, 2016-08, Vol.33 (4), p.37-48
2016
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In-Place Signal and Power Noise Waveform Capturing Within 3-D Chip Stacking
IEEE design and test, 2015-12, Vol.32 (6), p.87-98
2015
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A Comparative Study of State-of-the-Art High-Performance Spectral Test Methods
IEEE design and test, 2015-02, Vol.32 (1), p.26-35
2015
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Japanese technology : To gigabits and beyond
Semiconductor international, 1997-11, Vol.20 (13), p.111-115
1997
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A Sensor-Assisted Self-Authentication Framework for Hardware Trojan Detection
IEEE design and test, 2013-10, Vol.30 (5), p.74-82
2013
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