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Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading

IEEE transactions on components and packaging technologies, 2007-12, Vol.30 (4), p.824-829

2007

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A qualitative study on general practitioners’ perspectives on late-life depression in Singapore—part I: patient presentations and behavioursResearch in context

The Lancet regional health. Western Pacific, 2024-10, Vol.51, p.101170

2024

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Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive

International journal of adhesion and adhesives, 2005-02, Vol.25 (1), p.1-12

2005

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Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Microelectronic engineering, 2014-01, Vol.113, p.40-49

2014

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Analysis of encapsulation process in 3D stacked chips with different microbump array

International communications in heat and mass transfer, 2012-12, Vol.39 (10), p.1616-1623

2012

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Predicting the residual strength for environmentally degraded adhesive lap joints

International journal of adhesion and adhesives, 2006-08, Vol.26 (5), p.325-336

2006

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FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

Microelectronics and reliability, 2013-04, Vol.53 (4), p.600-611

2013

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Medical and psychosocial factors associated with antibiotic prescribing in primary care: survey questionnaire and factor analysis

British journal of general practice, 2017-03, Vol.67 (656), p.e168-e177

2017

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A qualitative study on general practitioners’ perspectives on late-life depression in Singapore—part I: patient presentations and behaviours

The Lancet regional health. Western Pacific, 2024-10, Vol.51, p.101170, Article 101170

2024

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Environmental degradation of the interfacial fracture energy in an adhesively bonded joint

Engineering fracture mechanics, 2002-12, Vol.69 (18), p.2113-2128

2002

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FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

Applied Mechanics and Materials, 2015-08, Vol.786 (Trends and Applications in Mechanical Engineering), p.361-366

2015

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COVID-19 primary care response and challenges in Singapore: a tale of two curves

Hong Kong medical journal = Xianggang yi xue za zhi, 2021-02, Vol.27 (1), p.70-72

2021

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Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

Engineering applications of computational fluid mechanics, 2013, Vol.7 (2), p.210-222

2013

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A NEW METHOD FOR ESTIMATING THE MOISTURE CONTENT AND FLEXIBILITY OF POLYMERISED BENTONITE CLAY MAT

Journal of engineering science & technology, 2017-04, Vol.12 (4), p.948-957

2017

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The effect of moisture on the failure locus and fracture energy of an epoxy-steel interface

Journal of adhesion science and technology, 2002-01, Vol.16 (11), p.1407-1429

2002

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Analysis of the interaction between edge and line finding techniques

Pattern recognition, 2001-06, Vol.34 (6), p.1127-1146

2001

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Kinematic modelling and analysis of mobile robots with omni-directional wheels

7th International Conference on Control, Automation, Robotics and Vision, 2002. ICARCV 2002, 2002, Vol.2, p.820-825 vol.2

2002

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Solder joint fatigue in a surface-mount assembly subjected to mechanical loading

2005 7th Electronic Packaging Technology Conference, 2005, Vol.2, p.5 pp.

2005

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Mechatronics design and kinematic modelling of a singularityless omni-directional wheeled mobile robot

2003 IEEE International Conference on Robotics and Automation (Cat. No.03CH37422), 2003, Vol.3, p.3237-3242 vol.3

2003

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A Screening Methodology for VMIN Drift in SRAM Arrays with Application to Sub-65nm Nodes

2006 International Electron Devices Meeting, 2006, p.1-4

2006

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Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.102-108

2006

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A 1-Mbit CMOS dynamic RAM with design-for test functions

IEEE journal of solid-state circuits, 1986-10, Vol.21 (5), p.635-642

1986

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A spread spectrum packet radio

Proceedings of ICCS '94, 1994, Vol.2, p.389-392 vol.2

1994

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A conferencing spread spectrum radio

Proceedings of IEEE 3rd International Symposium on Spread Spectrum Techniques and Applications (ISSSTA'94), 1994, p.372-375 vol.2

1994

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A comprehensive overview of polyphenylene oxide-based anion exchange membranes from the perspective of ionic conductivity and alkaline stability

Journal of industrial and engineering chemistry (Seoul, Korea), 2024-10, Vol.138, p.49-71

2024

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Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading

A qualitative study on general practitioners’ perspectives on late-life depression in Singapore—part I: patient presentations and behavioursResearch in context

Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Analysis of encapsulation process in 3D stacked chips with different microbump array

Predicting the residual strength for environmentally degraded adhesive lap joints

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

Medical and psychosocial factors associated with antibiotic prescribing in primary care: survey questionnaire and factor analysis

A qualitative study on general practitioners’ perspectives on late-life depression in Singapore—part I: patient presentations and behaviours

Environmental degradation of the interfacial fracture energy in an adhesively bonded joint

FSI Analysis of the Effect of Aspect Ratio of Stacked Chip in Encapsulation Process of Moulded Underfill Packaging

COVID-19 primary care response and challenges in Singapore: a tale of two curves

Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF)

A NEW METHOD FOR ESTIMATING THE MOISTURE CONTENT AND FLEXIBILITY OF POLYMERISED BENTONITE CLAY MAT

The effect of moisture on the failure locus and fracture energy of an epoxy-steel interface

Analysis of the interaction between edge and line finding techniques

Kinematic modelling and analysis of mobile robots with omni-directional wheels

Solder joint fatigue in a surface-mount assembly subjected to mechanical loading

Mechatronics design and kinematic modelling of a singularityless omni-directional wheeled mobile robot

A Screening Methodology for VMIN Drift in SRAM Arrays with Application to Sub-65nm Nodes

Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

A 1-Mbit CMOS dynamic RAM with design-for test functions

A spread spectrum packet radio

A conferencing spread spectrum radio

A comprehensive overview of polyphenylene oxide-based anion exchange membranes from the perspective of ionic conductivity and alkaline stability

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