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Journal of sound and vibration, 2021-06, Vol.501, p.116077, Article 116077
2021
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Mechanical systems and signal processing, 2022-03, Vol.167, p.108592, Article 108592
2022
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Construction & building materials, 2016-05, Vol.110, p.145-153
2016
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Journal of materials processing technology, 2021-12, Vol.298, p.117315, Article 117315
2021
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IEEE transactions on electron devices, 2024-03, Vol.71 (3), p.1886-1892
2024
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Additive manufacturing, 2020-03, Vol.32, p.100910, Article 100910
2020
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Procedia manufacturing, 2020, Vol.47, p.261-267
2020
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Production engineering (Berlin, Germany), 2021-04, Vol.15 (2), p.223-233
2021
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Procedia manufacturing, 2020, Vol.47, p.1023-1028
2020
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Microelectronic engineering, 2010-05, Vol.87 (5), p.1370-1374
2010
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Production engineering (Berlin, Germany), 2009-12, Vol.3 (4-5), p.347-351
2009
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Additive manufacturing, 2020-08, Vol.34, p.101208, Article 101208
2020
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Procedia manufacturing, 2019, Vol.35, p.840-846
2019
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AIP Conference Proceedings, 2019, Vol.2113 (1)
2019
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Microelectronic engineering, 2017-03, Vol.171, p.44-52
2017
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Procedia CIRP, 2018, Vol.74, p.196-200
2018
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Additive manufacturing, 2020-05, Vol.33, p.101133, Article 101133
2020
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2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2019, p.1-6
2019
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IEEE transactions on magnetics, 2006-10, Vol.42 (10), p.3072-3074
2006
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Production engineering (Berlin, Germany), 2014-10, Vol.8 (5), p.645-658
2014
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Semiconductor science and technology, 2009-04, Vol.24 (4), p.045013-045013 (4)
2009
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Biomedizinische Technik, 2012-08, Vol.57 (SI-1 Track-E), p.572-575
2012
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2014 IEEE International Conference on IC Design & Technology, 2014, p.1-4
2014
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Solid state technology, 2012-09, Vol.55 (7), p.17-19
2012
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1. Aufl., 2008
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