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Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2022-09, Vol.40 (5)

2022

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Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory

Japanese Journal of Applied Physics, 2020-04, Vol.59 (SG), p.SGGB12

2020

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Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks

IEEE journal of the Electron Devices Society, 2020, Vol.8, p.1266-1271

2020

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Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

IEEE journal of the Electron Devices Society, 2019, Vol.7, p.1225-1231

2019

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Study of Al-doped ZnO Transparent Stimulus Electrode for Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip

Sensors and materials, 2018, Vol.30 (2), p.225

2018

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Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system

Japanese Journal of Applied Physics, 2018-04, Vol.57 (4S), p.4

2018

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Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC

Japanese Journal of Applied Physics, 2016-04, Vol.55 (4S), p.4

2016

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On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2

Journal of polymer science (2020), 2020-08, Vol.58 (16), p.2248-2258

2020

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Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties

Japanese Journal of Applied Physics, 2017-04, Vol.56 (4S), p.4-04CM05

2017

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Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC

Japanese Journal of Applied Physics, 2016-04, Vol.55 (4S), p.4

2016

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Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system

Japanese Journal of Applied Physics, 2016-04, Vol.55 (4S), p.4

2016

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Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

Japanese Journal of Applied Physics, 2015-03, Vol.54 (3), p.30206-1-030206-6

2015

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The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS

IEEE journal of the Electron Devices Society, 2019, Vol.7, p.382-387

2019

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Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis

Japanese Journal of Applied Physics, 2013-04, Vol.52 (4), p.04CL03-04CL03-5

2013

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Investigation of Local Bending Stress Effect on Complementary Metal--Oxide--Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration

Japanese Journal of Applied Physics, 2013-04, Vol.52 (4), p.04CB11-04CB11-5

2013

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Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Japanese Journal of Applied Physics, 2024-04, Vol.63 (4), p.4

2024

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Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window

Japanese Journal of Applied Physics, 2018-04, Vol.57 (4S), p.4

2018

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Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording

Transactions of Japanese Society for Medical and Biological Engineering, 2014, Vol.52(Supplement), pp.O-377-O-378

2014

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Development of Chip-surface Stimulus Electrode Array for Fully-implantable Subretinal Prosthesis Chip

Transactions of Japanese Society for Medical and Biological Engineering, 2014, Vol.52(Supplement), pp.O-253-O-254

2014

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Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Japanese Journal of Applied Physics, 2020-02, Vol.59 (SB), p.SBBA04

2020

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Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces

Japanese Journal of Applied Physics, 2017-04, Vol.56 (4S), p.4-04CM04

2017

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Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber

Japanese Journal of Applied Physics, 2017-04, Vol.56 (4S), p.4-04CM08

2017

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Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs

2018 IEEE International Interconnect Technology Conference (IITC), 2018, p.135-137

2018

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Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.264-269

2019

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On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2

Journal of polymer science (2020), 2020-08, Vol.58 (16), p.2248-2258

2020

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Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics

Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory

Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks

Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

Study of Al-doped ZnO Transparent Stimulus Electrode for Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip

Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system

Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC

On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2

Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties

Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC

Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system

Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration

The Effect of Tungsten Volume on Residual Stress and Cell Characteristics in MONOS

Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis

Investigation of Local Bending Stress Effect on Complementary Metal--Oxide--Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration

Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window

Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording

Development of Chip-surface Stimulus Electrode Array for Fully-implantable Subretinal Prosthesis Chip

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces

Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber

Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs

Mechanical and Electrical Characterization of FOWLP-Based Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO 2

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