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Japanese Encephalitis in Two Children — United States, 2010

MMWR. Morbidity and mortality weekly report, 2011-03, Vol.60 (9), p.276-278

2011

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Inner-Shell Excitation Spectroscopy and X-ray Photoemission Electron Microscopy of Adhesion Promoters

The journal of physical chemistry. B, 2005-04, Vol.109 (13), p.6343-6354

2005

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On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Journal of electronic packaging, 2000-03, Vol.122 (1), p.28-33

2000

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An instrument for precise measurement of viscoelastic properties of low viscosity dilute macromolecular solutions at frequencies from 20 to 500 kHz

Journal of rheology (New York : 1978), 1994-07, Vol.38 (4), p.1195-1210

1994

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Local modification of solvent dynamics by polymeric solutes

Journal of non-crystalline solids, 1991-06, Vol.131, p.537-543

1991

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Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes

MRS proceedings, 2003, Vol.766, Article E7.5

2003

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D-101 From Lab to Fab: The Development and Deployment of New Metrology Technology for the Global Semiconductor Industry— Invited

Powder diffraction, 2004-06, Vol.19 (2), p.195-195

2004

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Planarization with Cyclotene™ 3022 (BCB) Polymer Coatings

MRS proceedings, 1993, Vol.308, Article 517

1993

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Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings

MRS proceedings, 1992, Vol.264, Article 135

1992

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Organic Polymer Dielectrics in Microelectronic Technologies: Reliability Requirements, Testing, and Qualification

MRS proceedings, 1994, Vol.338, Article 589

1994

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Advances in the Thermal-Oxidative Stabilization of Divinyl Siloxane Bis-Benzocyclobutene Polymer Coatings

MRS proceedings, 1992-01, Vol.265 (1), p.275-280

1992

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Dissociation kinetics of metal ion-2,6-dicarboxypiperidineacetic acid complexes: nickel(II) and cadmium(II)

Inorganic chemistry, 1970-01, Vol.9 (1), p.29-32

1970

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Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates

MRS proceedings, 1993, Vol.323, Article 365

1993

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A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.473-478

2004

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Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), 2001, p.60-62

2001

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Local modification of solvent dynamics by polymeric solutes

Journal of non-crystalline solids, 1991, Vol.131-33, p.537-543

1991

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ChemInform Abstract: KINETIK DER DISSOZIATION VON METALLION‐2,6‐DICARBOXYPIPERIDINOESSIGSAEURE‐KOMPLEXEN, NICKEL(II) UND CADMIUM(II)

Chemischer informationsdienst. Organische Chemie, 1970-03, Vol.1 (13)

1970

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Japanese Encephalitis in Two Children — United States, 2010

Inner-Shell Excitation Spectroscopy and X-ray Photoemission Electron Microscopy of Adhesion Promoters

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

An instrument for precise measurement of viscoelastic properties of low viscosity dilute macromolecular solutions at frequencies from 20 to 500 kHz

Local modification of solvent dynamics by polymeric solutes

Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes

D-101 From Lab to Fab: The Development and Deployment of New Metrology Technology for the Global Semiconductor Industry— Invited

Planarization with Cyclotene™ 3022 (BCB) Polymer Coatings

Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings

Organic Polymer Dielectrics in Microelectronic Technologies: Reliability Requirements, Testing, and Qualification

Advances in the Thermal-Oxidative Stabilization of Divinyl Siloxane Bis-Benzocyclobutene Polymer Coatings

Dissociation kinetics of metal ion-2,6-dicarboxypiperidineacetic acid complexes: nickel(II) and cadmium(II)

Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates

A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Local modification of solvent dynamics by polymeric solutes

ChemInform Abstract: KINETIK DER DISSOZIATION VON METALLION‐2,6‐DICARBOXYPIPERIDINOESSIGSAEURE‐KOMPLEXEN, NICKEL(II) UND CADMIUM(II)

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