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Study on Protection Coordination of a Flux-Lock Type SFCL With Over-Current Relay

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.1159-1163

2010

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Method of Recloser-Fuse Coordination in a Power Distribution System With Superconducting Fault Current Limiter

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.1164-1167

2010

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Dry release for surface micromachining with HF vapor-phase etching

Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.226-233

1997

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A liquid-filled microrelay with a moving mercury microdrop

Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.208-216

1997

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Improvement of dynamic characteristics for optical pickup actuator by magnetic circuit

Microsystem technologies : sensors, actuators, systems integration, 2003-03, Vol.9 (4), p.232-242

2003

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Microrivets for MEMS packaging: concept, fabrication, and strength testing

Journal of microelectromechanical systems, 1997-09, Vol.6 (3), p.217-225

1997

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Free-space fiber-optic switches based on MEMS vertical torsion mirrors

Journal of lightwave technology, 1999-01, Vol.17 (1), p.7-13

1999

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Electromagnetic Radiation Behavior of Low-Voltage Arcing Fault

IEEE transactions on power delivery, 2009-01, Vol.24 (1), p.416-423

Kim, C.J.

2009

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Package-Level Integrated LTCC Antenna for RF Package Application

IEEE transactions on advanced packaging, 2007-02, Vol.30 (1), p.132-141

2007

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A Liquid-Solid Direct Contact Low-Loss RF Micro Switch

Journal of microelectromechanical systems, 2009-10, Vol.18 (5), p.990-997

2009

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Fabrication of YBCO superconducting tape by metal organic chemical vapor deposition method

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.2751-2754

2005

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Fabrication of Very-High-Aspect-Ratio Micro Metal Posts and Gratings by Photoelectrochemical Etching and Electroplating

Journal of microelectromechanical systems, 2011-08, Vol.20 (4), p.876-884

2011

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Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

Journal of microelectromechanical systems, 2009-06, Vol.18 (3), p.588-596

2009

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Electrowetting and electrowetting-on-dielectric for microscale liquid handling

Sensors and actuators. A, Physical, 2002, Vol.95 (2), p.259-268

2002

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Fully Depleted Polysilicon TFTs for Capacitorless 1T-DRAM

IEEE electron device letters, 2009-07, Vol.30 (7), p.742-744

2009

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A degassing plate with hydrophobic bubble capture and distributed venting for microfluidic devices

Journal of micromechanics and microengineering, 2006-02, Vol.16 (2), p.419-424

2006

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Gate-to-Source/Drain Nonoverlap Device for Soft-Program Immune Unified RAM (URAM)

IEEE electron device letters, 2009-05, Vol.30 (5), p.544-546

2009

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A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator

IEEE microwave and wireless components letters, 2009-08, Vol.19 (8), p.512-514

2009

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MR characteristics of synthetic ferrimagnet based spin-valves with different pinning layer thickness ratios

IEEE transactions on magnetics, 2000-09, Vol.36 (5), p.2857-2859

2000

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Nanostructured surfaces for dramatic reduction of flow resistance in droplet-based microfluidics

Proceedings, IEEE micro electro mechanical systems, 2002, p.479-482

2002

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Electrostatic Side-Drive Rotary Stage on Liquid-Ring Bearing

Journal of microelectromechanical systems, 2014-02, Vol.23 (1), p.147-156

2014

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Dissolution and resolidification of SmBa2Cu3O7-y seed during top seeded melt texturing of YBa2Cu3O7-y

IEEE transactions on applied superconductivity, 1999-06, Vol.9 (2), p.2097-2100

1999

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Control of growth rate and texture formation of YBa2Cu3O7-y single-domained crystal by applying two-step undercooling in TSMG

IEEE transactions on applied superconductivity, 1999-06, Vol.9 (2), p.2093-2096

1999

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Mechanical properties of aerogel-like thin films used for MEMS

Journal of micromechanics and microengineering, 2004-05, Vol.14 (5), p.681-686

2004

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Preparation of YBa2Cu3Ox film deposited on various substrates by MOCVD processing

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.2767-2770

2005

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Study on Protection Coordination of a Flux-Lock Type SFCL With Over-Current Relay

Method of Recloser-Fuse Coordination in a Power Distribution System With Superconducting Fault Current Limiter

Dry release for surface micromachining with HF vapor-phase etching

A liquid-filled microrelay with a moving mercury microdrop

Improvement of dynamic characteristics for optical pickup actuator by magnetic circuit

Microrivets for MEMS packaging: concept, fabrication, and strength testing

Free-space fiber-optic switches based on MEMS vertical torsion mirrors

Electromagnetic Radiation Behavior of Low-Voltage Arcing Fault

Package-Level Integrated LTCC Antenna for RF Package Application

A Liquid-Solid Direct Contact Low-Loss RF Micro Switch

Fabrication of YBCO superconducting tape by metal organic chemical vapor deposition method

Fabrication of Very-High-Aspect-Ratio Micro Metal Posts and Gratings by Photoelectrochemical Etching and Electroplating

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

Electrowetting and electrowetting-on-dielectric for microscale liquid handling

Fully Depleted Polysilicon TFTs for Capacitorless 1T-DRAM

A degassing plate with hydrophobic bubble capture and distributed venting for microfluidic devices

Gate-to-Source/Drain Nonoverlap Device for Soft-Program Immune Unified RAM (URAM)

A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator

MR characteristics of synthetic ferrimagnet based spin-valves with different pinning layer thickness ratios

Nanostructured surfaces for dramatic reduction of flow resistance in droplet-based microfluidics

Electrostatic Side-Drive Rotary Stage on Liquid-Ring Bearing

Dissolution and resolidification of SmBa2Cu3O7-y seed during top seeded melt texturing of YBa2Cu3O7-y

Control of growth rate and texture formation of YBa2Cu3O7-y single-domained crystal by applying two-step undercooling in TSMG

Mechanical properties of aerogel-like thin films used for MEMS

Preparation of YBa2Cu3Ox film deposited on various substrates by MOCVD processing

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