UB Paderborn / Katalog / Suche / in CDI

1.2-kV SiC Superjunction Dual-channel MOSFET with Ultra Low Specific on-Resistance

2022 IEEE 17th Conference on Industrial Electronics and Applications (ICIEA), 2022, p.64-68

2022

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A 1.8-2GHz VCO with automatic compensation for bond wire inductance variation

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1325-1328 vol.2

2004

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A 1.8V CMOS fourth-order Gm-C bandpass sigma-delta modulator dedicated to front-end ultrasonic receivers

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1425-1428 vol.2

2004

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1-D Manual Tracing Based on a High Density Haptic Stimulation Grid - a Pilot Effort

2023 IEEE World Haptics Conference (WHC), 2023, p.375-381

2023

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A 10-bit 20-Msample/s 49mW CMOS pipelined A/D converter

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1526-1529 vol.2

2004

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An 11,424-gate dynamic optically reconfigurable gate array VLSI

2008 International Conference on Field-Programmable Technology, 2008, p.293-296

2008

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193 Excimer Laser Machined Electromagnetic Optical Scanning Mirror for a Laser Projection Display

Materials science forum, 2006-01, Vol.505-507, p.601-606

2006

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1GHz monolithic high spectrum purity fractional-N frequency synthesizer with a 3-b third-order delta-sigma modulator

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1504-1507 vol.2

2004

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A 2.4 GHz fully integrated CMOS LC VCO

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1329-1332 vol.2

2004

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A 2.5 GHz CMOS dual-modulus prescaler for RF frequency synthesizer

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1547-1550 vol.2

2004

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A 2-D Capacitance Solver with Finite Difference Method

2020 China Semiconductor Technology International Conference (CSTIC), 2020, p.1-3

2020

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2-D modeling of nanoscale multigate MOSFETs

2008 9th International Conference on Solid-State and Integrated-Circuit Technology, 2008, p.460-463

2008

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2-DE Compared with iTRAQ-based Proteomic Analysis of the Functional Regulation of Proteins in Rhodococcus sp. BAP-1 Response to Fluoranthene

IOP conference series. Earth and environmental science, 2018-01, Vol.111 (1), p.12032

2018

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2018 2nd International Conference on Environmental and Energy Engineering (IC3E 2018)

IOP conference series. Earth and environmental science, 2018-05, Vol.146 (1)

2018

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2020 International Conference on Data Processing Techniques and Applications for Cyber-Physical Systems: Dpta 2020

1st ed. 2021., 2021

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20um Pd-copper wire bonding process development on ASM Eagle60 AP

2013 14th International Conference on Electronic Packaging Technology, 2013, p.238-241

2013

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2D Modeling of Electromagnetic Telemetry

Borehole Electromagnetic Telemetry System, 2019, p.7-20

2019

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A 2D Simulation of Grain Boundary Geometry for Normal Grain Growth

Materials science forum, 2011, Vol.663-665, p.990-994

2011

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The 2nd BOWS Contest: Wavelet-Based Bayesian Denoising Attack on Image Watermarking

2008 International Conference on Intelligent Information Hiding and Multimedia Signal Processing, 2008, p.473-476

2008

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A 3.125Gbit/s CMOS clock and data recovery circuit

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.2, p.1429-1432 vol.2

2004

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3-D Finite Element Simulation of the Vertical-Horizontal Rolling Process

Advanced materials research, 2011, Vol.145, p.187-192

2011

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3-D shape measurement of a free surface from a single image produced using multiple laser spots

2008 3rd International Conference on Sensing Technology, 2008, p.153-157

2008

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3-D simulation of geometrical variations impact on nanoscale FinFETs

2008 9th International Conference on Solid-State and Integrated-Circuit Technology, 2008, p.408-411

2008

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A 3-D wafer level hermetical packaging for MEMS

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.607-610 vol.1

2004

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3-dimensional nano-CMOS transistors to overcome scaling limits

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.35-40 vol.1

2004

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1.2-kV SiC Superjunction Dual-channel MOSFET with Ultra Low Specific on-Resistance

A 1.8-2GHz VCO with automatic compensation for bond wire inductance variation

A 1.8V CMOS fourth-order Gm-C bandpass sigma-delta modulator dedicated to front-end ultrasonic receivers

1-D Manual Tracing Based on a High Density Haptic Stimulation Grid - a Pilot Effort

A 10-bit 20-Msample/s 49mW CMOS pipelined A/D converter

An 11,424-gate dynamic optically reconfigurable gate array VLSI

193 Excimer Laser Machined Electromagnetic Optical Scanning Mirror for a Laser Projection Display

1GHz monolithic high spectrum purity fractional-N frequency synthesizer with a 3-b third-order delta-sigma modulator

A 2.4 GHz fully integrated CMOS LC VCO

A 2.5 GHz CMOS dual-modulus prescaler for RF frequency synthesizer

A 2-D Capacitance Solver with Finite Difference Method

2-D modeling of nanoscale multigate MOSFETs

2-DE Compared with iTRAQ-based Proteomic Analysis of the Functional Regulation of Proteins in Rhodococcus sp. BAP-1 Response to Fluoranthene

2018 2nd International Conference on Environmental and Energy Engineering (IC3E 2018)

2020 International Conference on Data Processing Techniques and Applications for Cyber-Physical Systems: Dpta 2020

20um Pd-copper wire bonding process development on ASM Eagle60 AP

2D Modeling of Electromagnetic Telemetry

A 2D Simulation of Grain Boundary Geometry for Normal Grain Growth

The 2nd BOWS Contest: Wavelet-Based Bayesian Denoising Attack on Image Watermarking

A 3.125Gbit/s CMOS clock and data recovery circuit

3-D Finite Element Simulation of the Vertical-Horizontal Rolling Process

3-D shape measurement of a free surface from a single image produced using multiple laser spots

3-D simulation of geometrical variations impact on nanoscale FinFETs

A 3-D wafer level hermetical packaging for MEMS

3-dimensional nano-CMOS transistors to overcome scaling limits

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