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A magnetically controlled chemical–mechanical polishing (MC‐CMP) approach for fabricating channel‐cut silicon crystal optics for the High Energy Photon Source

Journal of synchrotron radiation, 2023-01, Vol.30 (1), p.84-89

2023

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Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Applied sciences, 2021-08, Vol.11 (16), p.7232

2021

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CMP Process Optimization Engineering by Machine Learning

IEEE transactions on semiconductor manufacturing, 2021-08, Vol.34 (3), p.280-285

2021

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IEEE_Xplore

Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

Materials, 2024-01, Vol.17 (3), p.679

2024

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Preparation of SiC/SiO2 Hard Core–Soft Shell Abrasive and Its CMP Behavior on Sapphire Substrate

Journal of electronic materials, 2020-02, Vol.49 (2), p.1301-1307

2020

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A Half-Century of CMP

Communications in mathematical physics, 2016-10, Vol.347 (1), p.1-2

Yau, Horng-Tzer

2016

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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

Applied sciences, 2021-04, Vol.11 (8), p.3521

2021

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Advances in CMP Polishing Technologies

Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

1, 2011

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CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Micromachines (Basel), 2023-01, Vol.14 (1), p.200

2023

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Resource Isolation Method for Program'S Performance on CMP

Journal of physics. Conference series, 2017-10, Vol.910 (1), p.12007

2017

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Hybrid CMP Slurry Supply System Using Ionization and Atomization

Applied sciences, 2021-03, Vol.11 (5), p.2217

2021

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A Fine-Grained, End-To-End Feature-Scale CMP Modeling Paradigm Based on Fully Convolutional Neural Networks

IEEE transactions on semiconductor manufacturing, 2023-05, Vol.36 (2), p.1-1

2023

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IEEE_Xplore

Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length

Micromachines (Basel), 2024-04, Vol.15 (4), p.549

2024

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CMP-UNet: A Retinal Vessel Segmentation Network Based on Multi-Scale Feature Fusion

Electronics (Basel), 2023-11, Vol.12 (23), p.4743

2023

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AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP)

Journal of materials science. Materials in electronics, 2015-12, Vol.26 (12), p.9921-9928

2015

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Research on influences of contact force in chemical mechanical polishing (CMP) process

AIP advances, 2015-04, Vol.5 (4), p.041305-041305-9

2015

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Electron Beam Inspection in Physical Mode: Overpolish Monitoring of RMG CMP

IEEE transactions on semiconductor manufacturing, 2020-08, Vol.33 (3), p.352-356

2020

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IEEE_Xplore

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Journal of materials science. Materials in electronics, 2013-12, Vol.24 (12), p.5040-5047

2013

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Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process

Applied sciences, 2023-03, Vol.13 (6), p.3758

2023

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Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Micromachines (Basel), 2020-07, Vol.11 (7), p.705

2020

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Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

Frontiers in physics, 2022-02, Vol.9

2022

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Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements

Micromachines (Basel), 2018-10, Vol.9 (11), p.542

2018

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Effect of 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA) on Cu/Ta chemical mechanical planarization (CMP) in the barrier layer: A novel complexing agent and the dual role on Cu

Surfaces and interfaces, 2024-03, Vol.46, p.103969, Article 103969

2024

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Solid-silica core/mesoporous-silica shell composite abrasives: synthesis, characterization, and the effect of mesoporous shell structures on CMP

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (5), p.3817-3828

2018

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Effect of 1,2,4-triazole on galvanic corrosion between cobalt and copper in CMP based alkaline slurry

Journal of semiconductors, 2018-04, Vol.39 (4), p.46001

2018

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A magnetically controlled chemical–mechanical polishing (MC‐CMP) approach for fabricating channel‐cut silicon crystal optics for the High Energy Photon Source

Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

CMP Process Optimization Engineering by Machine Learning

Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

Preparation of SiC/SiO2 Hard Core–Soft Shell Abrasive and Its CMP Behavior on Sapphire Substrate

A Half-Century of CMP

Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime

Advances in CMP Polishing Technologies

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Resource Isolation Method for Program'S Performance on CMP

Hybrid CMP Slurry Supply System Using Ionization and Atomization

A Fine-Grained, End-To-End Feature-Scale CMP Modeling Paradigm Based on Fully Convolutional Neural Networks

Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length

CMP-UNet: A Retinal Vessel Segmentation Network Based on Multi-Scale Feature Fusion

AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP)

Research on influences of contact force in chemical mechanical polishing (CMP) process

Electron Beam Inspection in Physical Mode: Overpolish Monitoring of RMG CMP

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Mueller Matrix Ellipsometric Characterization of Nanoscale Subsurface Damage of 4H-SiC Wafers: From Grinding to CMP

Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements

Effect of 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA) on Cu/Ta chemical mechanical planarization (CMP) in the barrier layer: A novel complexing agent and the dual role on Cu

Solid-silica core/mesoporous-silica shell composite abrasives: synthesis, characterization, and the effect of mesoporous shell structures on CMP

Effect of 1,2,4-triazole on galvanic corrosion between cobalt and copper in CMP based alkaline slurry

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