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Journal of materials science. Materials in electronics, 2022-05, Vol.33 (13), p.10450-10460
2022
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1, 2017
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.709-710
2018
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Journal of materials science. Materials in electronics, 2024-05, Vol.35 (14), p.960
2024
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Journal of electronic materials, 2017-03, Vol.46 (3), p.1674-1682
2017
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Journal of electronic materials, 2016-01, Vol.45 (1), p.116-124
2016
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.725-734
2018
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Journal of electronic materials, 2014-12, Vol.43 (12), p.4421-4427
2014
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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1309-1315
2010
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2010 IEEE International Reliability Physics Symposium, 2010, p.252-258
2010
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Electromigration Mechanisms of Solder Joints with Limited Sn Volume in Advanced Electronic Packaging
2021
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2017 International Conference on Infocom Technologies and Unmanned Systems (Trends and Future Directions) (ICTUS), 2017, p.818-824
2017
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.473-478
2020
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2009 46th ACM/IEEE Design Automation Conference, 2009, p.460-465
2009
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.440-447
2018
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3D Microelectronic Packaging, 2017, p.1-15
2017
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2280-2287
2018
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.755-765
2016
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3D Microelectronic Packaging, 2017, p.421-459
2017
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.441-447
2017
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.99-105
2015
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2015 Fifth International Conference on Advanced Computing & Communication Technologies, 2015, p.340-346
2015
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1128-1134
2016
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2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1263-1268
2011
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1145-1152
2017
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