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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1213-1218
2023
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2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010, p.25-32
2010
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.875-878
2021
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IEEE sensors journal, 2019-09, Vol.19 (18), p.7868-7874
2019
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1175-1180
- Chen, Qianwen
- Belyansky, Michael
- Sulehria, Yasir
- Horibe, Akihiro
- Qin, Liqiao
- Pujari, Ruturaj
- Perfecto, Eric
- Lie, Fee Li
- Butt, Shahid
- Polomoff, Nick
- Miyazawa, Risa
- Kohara, Sayuri
- Farooq, Mukta
- Hisada, Takashi
- Oakley, Jennifer
- Skordas, Spyridon
- Fan, Susan
- Sakuma, Katsuyuki
- Knickerbocker, John
- Mcherron, Dale
- Tamura, Takeshi
- Ishii, Takayuki
- Jaipan, Panupong
- Nishimura, Satoshi
- Son, Ilseok
- Maeda, Yohei
- Koga, Takashi
- Klein, Joseph
- Tashiro, Kei
- Arkalgud, Sitaram
- Kondo, Yoshihiro
2023
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-04, Vol.13 (4), p.1-1
2023
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.318-324
2015
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29th IEEE Semiconductor Thermal Measurement and Management Symposium, 2013, p.1-6
2013
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.585-589
2023
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1418-1425
2023
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.579-585
2022
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.292-297
2021
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.408-414
2021
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.977-980
- Farooq, Mukta
- Kumar, Arvind
- Lee, Sae-Kyu
- Bonam, Ravi
- Gomez, Juan-Manuel
- Kelly, James
- Hosokawa, Kohji
- Nomura, Akiyo
- Kohda, Yasuteru
- Dickson, Timothy
- Sakuma, Katsuyuki
- Mori, Hiroyuki
- Rubin, Joshua
- Saraf, Iqbal
- Pai, Vinay
- Nieves, Pablo
- Li, Yandong
- DelaPena, Abraham
- Wassick, Thomas
- Perfecto, Eric
- Carr, Christopher
- Sardesai, Viraj
- Miller, Eric
- Oakley, Jennifer
- Skordas, Spyridon
- Teehan, Sean
- McHerron, Dale
- Burns, Jeff
- Divakaruni, Rama
2022
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2018 International Flexible Electronics Technology Conference (IFETC), 2018, p.1-2
2018
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2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1147-1152
2011
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2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.430-435
2012
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2009 IEEE International Conference on 3D System Integration, 2009, p.1-5
2009
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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.81-81
2012
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2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-7
2012
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2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-4
2012
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2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, p.1-5
2010
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2010 IEEE CPMT Symposium Japan, 2010, p.1-4
2010
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Impact of program/erase stress induced hole current on data retention degradation for MONOS memories
2012
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