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Bond-pad damage in ultrasonic wedge bonding

Microelectronics and reliability, 2024-01, Vol.152, p.115279, Article 115279

2024

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Prediction of pad cratering fracture at the copper pad – Printed circuit board interface

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1454-1463

2012

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Chip Pad Inspection Method Based on an Improved YOLOv5 Algorithm

Sensors (Basel, Switzerland), 2022-09, Vol.22 (17), p.6685

2022

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A numerical study on slurry flow with CMP pad grooves

Microelectronic engineering, 2020-10, Vol.234, p.111437, Article 111437

2020

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A PAD-Based Unmanned Aerial Vehichle Route Planning Scheme for Remote Sensing in Huge Regions

Sensors (Basel, Switzerland), 2023-12, Vol.23 (24), p.9897

2023

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Precision Landing Tests of Tethered Multicopter and VTOL UAV on Moving Landing Pad on a Lake

Sensors (Basel, Switzerland), 2023-02, Vol.23 (4), p.2016

2023

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Defect Identification Method for Transformer End Pad Falling Based on Acoustic Stability Feature Analysis

Sensors (Basel, Switzerland), 2023-03, Vol.23 (6), p.3258

2023

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Flow Control in Porous Media: From Numerical Analysis to Quantitative μPAD for Ionic Strength Measurements

Sensors (Basel, Switzerland), 2021-05, Vol.21 (10), p.3328

2021

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Fabrication and Characterization of a Flexible Fluxgate Sensor with Pad-Printed Solenoid Coils

Sensors (Basel, Switzerland), 2020-04, Vol.20 (8), p.2275

2020

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Study on the Strength of the Brake Pad of a Freight Wagon under Uneven Loading in Operation

Sensors (Basel, Switzerland), 2024-01, Vol.24 (2), p.463

2024

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Preliminary Characterization of an Active CMOS Pad Detector for Tracking and Dosimetry in HDR Brachytherapy

Sensors (Basel, Switzerland), 2024-01, Vol.24 (2), p.692

2024

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Multipurpose Polymer Bragg Grating-Based Optomechanical Sensor Pad

Sensors (Basel, Switzerland), 2019-09, Vol.19 (19), p.4101

2019

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The investigation of the signal radiation mechanism of different GSG‐pads connection methods

International journal of numerical modelling, 2023-01, Vol.36 (1), p.n/a

2023

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Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

Sensors (Basel, Switzerland), 2021-10, Vol.21 (20), p.6802

2021

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A Wearable Head Mounted Display Bio-Signals Pad System for Emotion Recognition

Sensors (Basel, Switzerland), 2021-12, Vol.22 (1), p.142

2021

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A Finger Grip Force Sensor with an Open-Pad Structure for Glove-Type Assistive Devices

Sensors (Basel, Switzerland), 2019-12, Vol.20 (1), p.4

2019

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Performance on lapping quartz glass by UV curing fixed abrasive pad with Gr2O3-diamond composite abrasives

Materials science in semiconductor processing, 2024-01, Vol.169, p.107926, Article 107926

2024

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Methodology for pad conditioning sweep optimization for advanced nodes

Microelectronic engineering, 2019-08, Vol.216, p.111101, Article 111101

2019

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Reliability evaluation of thick Ag wire bonding on Ni pad for power devices

Microelectronics and reliability, 2024-01, Vol.152, p.115304, Article 115304

2024

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Assessment of Finger Fat Pad Effect on CSRR-Based Sensor Scattering Parameters for Non-Invasive Blood Glucose Level Detection

Sensors (Basel, Switzerland), 2023-01, Vol.23 (1), p.473

2023

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A Pressure-Pad-Embedded Treadmill Yields Time-Dependent Errors in Estimating Ground Reaction Force during Walking

Sensors (Basel, Switzerland), 2021-08, Vol.21 (16), p.5511

2021

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Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Microelectronics and reliability, 2023-12, Vol.151, p.115240, Article 115240

2023

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A Comprehensive Approach for Detecting Brake Pad Defects Using Histogram and Wavelet Features with Nested Dichotomy Family Classifiers

Sensors (Basel, Switzerland), 2023-11, Vol.23 (22), p.9093

2023

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Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Microelectronics and reliability, 2022-11, Vol.138, p.114716, Article 114716

2022

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Chemical/mechanical balance management through pad microstructure in CMP

Microelectronic engineering, 2018-08, Vol.195, p.36-40

2018

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Bond-pad damage in ultrasonic wedge bonding

Prediction of pad cratering fracture at the copper pad – Printed circuit board interface

Chip Pad Inspection Method Based on an Improved YOLOv5 Algorithm

A numerical study on slurry flow with CMP pad grooves

A PAD-Based Unmanned Aerial Vehichle Route Planning Scheme for Remote Sensing in Huge Regions

Precision Landing Tests of Tethered Multicopter and VTOL UAV on Moving Landing Pad on a Lake

Defect Identification Method for Transformer End Pad Falling Based on Acoustic Stability Feature Analysis

Flow Control in Porous Media: From Numerical Analysis to Quantitative μPAD for Ionic Strength Measurements

Fabrication and Characterization of a Flexible Fluxgate Sensor with Pad-Printed Solenoid Coils

Study on the Strength of the Brake Pad of a Freight Wagon under Uneven Loading in Operation

Preliminary Characterization of an Active CMOS Pad Detector for Tracking and Dosimetry in HDR Brachytherapy

Multipurpose Polymer Bragg Grating-Based Optomechanical Sensor Pad

The investigation of the signal radiation mechanism of different GSG‐pads connection methods

Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

A Wearable Head Mounted Display Bio-Signals Pad System for Emotion Recognition

A Finger Grip Force Sensor with an Open-Pad Structure for Glove-Type Assistive Devices

Performance on lapping quartz glass by UV curing fixed abrasive pad with Gr2O3-diamond composite abrasives

Methodology for pad conditioning sweep optimization for advanced nodes

Reliability evaluation of thick Ag wire bonding on Ni pad for power devices

Assessment of Finger Fat Pad Effect on CSRR-Based Sensor Scattering Parameters for Non-Invasive Blood Glucose Level Detection

A Pressure-Pad-Embedded Treadmill Yields Time-Dependent Errors in Estimating Ground Reaction Force during Walking

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

A Comprehensive Approach for Detecting Brake Pad Defects Using Histogram and Wavelet Features with Nested Dichotomy Family Classifiers

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Chemical/mechanical balance management through pad microstructure in CMP

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