UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm

Journal of electronic materials, 2024-08, Vol.53 (8), p.4421-4431

2024

Volltextzugriff (PDF)

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Journal of electronic materials, 2021-12, Vol.50 (12), p.6615-6628

2021

Volltextzugriff (PDF)

Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Journal of electronic materials, 2021-03, Vol.50 (3), p.699-709

2021

Volltextzugriff (PDF)

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Journal of electronic materials, 2019-01, Vol.48 (1), p.1-8

2019

Volltextzugriff (PDF)

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

Journal of electronic materials, 2021-12, Vol.50 (12), p.6584-6589

2021

Volltextzugriff (PDF)

A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Journal of electronic materials, 2023-06, Vol.52 (6), p.4169-4178

2023

Volltextzugriff (PDF)

Screen-pad printing for electrode patterning on curvy surfaces

Microsystem technologies : sensors, actuators, systems integration, 2016-03, Vol.22 (3), p.635-638

2016

Volltextzugriff (PDF)

Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

Journal of electronic materials, 2012, Vol.41 (1), p.11-21

2012

Volltextzugriff (PDF)

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Journal of electronic materials, 2016-12, Vol.45 (12), p.6130-6136

2016

Volltextzugriff (PDF)

Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

Journal of electronic materials, 2014-11, Vol.43 (11), p.4335-4343

2014

Volltextzugriff (PDF)

Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental Studies

Journal of electronic materials, 2014-07, Vol.43 (7), p.2738-2746

2014

Volltextzugriff (PDF)

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Journal of electronic materials, 2016-06, Vol.45 (6), p.3208-3219

2016

Volltextzugriff (PDF)

Electric conduction failure of ACF packages based on pad array aspect ratio consideration

Microsystem technologies : sensors, actuators, systems integration, 2016-12, Vol.22 (12), p.2883-2891

2016

Volltextzugriff (PDF)

The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing

Journal of electronic materials, 2019-05, Vol.48 (5), p.2770-2779

2019

Volltextzugriff (PDF)

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Journal of electronic materials, 2008-10, Vol.37 (10), p.1624-1630

2008

Volltextzugriff (PDF)

Effect of microfabrication defects on the performance of rarefaction gas-lubricated micro flexure pivot tilting pad gas bearing in power MEMS

Microsystem technologies : sensors, actuators, systems integration, 2017-08, Vol.23 (8), p.3401-3419

2017

Volltextzugriff (PDF)

Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization

Journal of electronic materials, 2013, Vol.42 (1), p.83-96

2013

Volltextzugriff (PDF)

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Journal of electronic materials, 2013, Vol.42 (1), p.97-102

2013

Volltextzugriff (PDF)

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

Journal of electronic materials, 2014, Vol.43 (1), p.170-175

2014

Volltextzugriff (PDF)

Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads

Journal of electronic materials, 2012-12, Vol.41 (12), p.3266-3275

2012

Volltextzugriff (PDF)

Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

Journal of electronic materials, 2012-12, Vol.41 (12), p.3276-3283

2012

Volltextzugriff (PDF)

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Journal of electronic materials, 2014-12, Vol.43 (12), p.4365-4373

2014

Volltextzugriff (PDF)

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Journal of electronic materials, 2010-03, Vol.39 (3), p.338-346

2010

Volltextzugriff (PDF)

Observations of IMC Formation for Au Wire Bonds to Al Pads

Journal of electronic materials, 2012-04, Vol.41 (4), p.748-756

2012

Volltextzugriff (PDF)

Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Journal of electronic materials, 2010-09, Vol.39 (9), p.1418-1421

2010

Volltextzugriff (PDF)

1 – 25 von 1.335

Suche als RSS-Feed

Aktive Filter

KollektionEbook Central Perpetual and DDA

KollektionIEEE Xplore

SpracheSerbian

ThemaEngineering, Electrical & Electronic

ThemaInstrumentation

ThemaPhysical Sciences

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(1.334)
Mit Volltextzugriff
(1.335)

Publikationsform

Artikel
(1.335)

Sprache

Englisch
(1.335)

Erscheinungsjahr

n.n

Thema

Engineering
(1.335)
Science & Technology
(1.335)
Technology
(1.335)
Physics
(1.328)
Physics, Applied
(1.327)
Electronics And Microelectronics
(1.301)
Materials Science
(1.223)
Materials Science, Multidisciplinary
(1.221)
Nanoscience & Nanotechnology
(678)
Science & Technology - Other Topics
(678)
Mechanical Engineering
(661)
Nanotechnology
(654)
Technical Paper
(634)
Characterization And Evaluation Of Materials
(568)
Chemistry And Materials Science
(567)
Optical And Electronic Materials
(567)
Solid State Physics
(567)

12 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(6)

Menü

Weitere Dienste

Einstellungen

Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Screen-pad printing for electrode patterning on curvy surfaces

Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM

Development of a Novel Polishing Pad with a Phyllotactic Pattern, and Experimental Studies

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Electric conduction failure of ACF packages based on pad array aspect ratio consideration

The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Effect of microfabrication defects on the performance of rarefaction gas-lubricated micro flexure pivot tilting pad gas bearing in power MEMS

Impact of Pad Conditioning on Thickness Profile Control in Chemical Mechanical Planarization

Experimental Evaluation of the Effect of Pad Debris Size on Microscratches during CMP Process

Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads

Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Observations of IMC Formation for Au Wire Bonds to Al Pads

Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems

Aktive Filter

Suchergebnisse filtern