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The investigation of the signal radiation mechanism of different GSG‐pads connection methods

International journal of numerical modelling, 2023-01, Vol.36 (1), p.n/a

2023

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Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive

Microwave and optical technology letters, 2012-11, Vol.54 (11), p.2606-2610

Moon, Sungwook

2012

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Analysis of on‐chip GSG pads coupling effects on laterally‐coupled and double‐stacked inductors in the millimeter‐wave frequency regime

International journal of numerical modelling, 2023-11, Vol.36 (6)

2023

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Active in‐cell touch circuit using floating common electrode as sensing pad for the large size in‐plane‐switching liquid crystal displays

Journal of the Society for Information Display, 2017-10, Vol.25 (10), p.610-620

2017

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A Simple and Reliable Method to Extract The Electrical Equivalent Circuits of CMOS pads

Microwave and optical technology letters, 2013-12, Vol.55 (12), p.3033-3037

2013

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A methodology for accurate modeling of a pad structure from S-parameter measurements

Microwave and optical technology letters, 2005-04, Vol.45 (2), p.115-118

2005

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SMT pad using a coaxial line structure for LTCC SoP applications

Microwave and optical technology letters, 2009-07, Vol.51 (7), p.1769-1772

Lee, Young Chul

2009

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Design and application of grounded pin-pad resonators in LTCC components

Microwave and optical technology letters, 2005-11, Vol.47 (4), p.321-323

2005

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A broadband small‐signal model extraction methodology over 0.2‐220 GHz for bulk FinFETs in RF CMOS technology

International journal of numerical modelling, 2020-07, Vol.33 (4), p.n/a

2020

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Substrate integrated waveguide filter on LCP substrate at 94 GHz

Microwave and optical technology letters, 2016-03, Vol.58 (3), p.577-580

2016

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Design of broadband circularly polarized antenna via loading coupled rotated dipoles

Microwave and optical technology letters, 2019-02, Vol.61 (2), p.425-430

2019

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Influence of ground-pad dimensions on the performance of vialess transition from coplanar waveguide to microstrip

Microwave and optical technology letters, 2005-04, Vol.45 (2), p.112-115

2005

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An improved wideband equivalent circuit model for integrated spiral inductors in CMOS technology

International journal of numerical modelling, 2020-05, Vol.33 (3), p.n/a

2020

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Verification of transmission line de-embedding method for on-chip spiral inductor based on electromagnetic simulation

International journal of numerical modelling, 2016-07, Vol.29 (4), p.686-694

2016

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Microwave-driven thunder materials

Microwave and optical technology letters, 2003-03, Vol.36 (5), p.331-333

2003

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A technique to extract extrinsic parameters of HEMTs

Microwave and optical technology letters, 2005-03, Vol.44 (6), p.489-492

Jeon, Man-Young

2005

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Modeling of high-frequency noise of silicon CMOS transistors for RFIC design

International journal of numerical modelling, 2014-09, Vol.27 (5-6), p.802-811

2014

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Broadband flip‐suspended‐microstrip transition for millimeter‐wave MMIC package

Microwave and optical technology letters, 2023-06, Vol.65 (6), p.1608-1614

2023

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Fabrication of system with probe for high-frequency measurement applications

Microwave and optical technology letters, 2010-09, Vol.52 (9), p.2083-2087

2010

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Hybrid dual-antenna for the 3.6-GHz LTE operation in the tablet computer

Microwave and optical technology letters, 2015-11, Vol.57 (11), p.2592-2598

2015

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A low‐cost broadband millimeter‐wave bias tee network using SICL technology

Microwave and optical technology letters, 2023-12, Vol.65 (12), p.3171-3179

2023

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Modeling the package of a LNA with a 3D-EM simulator

Microwave and optical technology letters, 2013-07, Vol.55 (7), p.1435-1440

2013

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Fully‐integrated active matrix programmable UV and blue micro‐LED display system‐on‐panel (SoP)

Journal of the Society for Information Display, 2017-04, Vol.25 (4), p.240-248

2017

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Design and fabrication of a small‐form transmitter optical subassembly for 100 Gbps short reach optical interconnect

Microwave and optical technology letters, 2017-12, Vol.59 (12), p.3181-3185

2017

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Submillimeter-wave InP HBT power amplifier using impedance-transforming two-way balun

Microwave and optical technology letters, 2015-08, Vol.57 (8), p.1831-1834

2015

Volltextzugriff (PDF)

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The investigation of the signal radiation mechanism of different GSG‐pads connection methods

Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive

Analysis of on‐chip GSG pads coupling effects on laterally‐coupled and double‐stacked inductors in the millimeter‐wave frequency regime

Active in‐cell touch circuit using floating common electrode as sensing pad for the large size in‐plane‐switching liquid crystal displays

A Simple and Reliable Method to Extract The Electrical Equivalent Circuits of CMOS pads

A methodology for accurate modeling of a pad structure from S-parameter measurements

SMT pad using a coaxial line structure for LTCC SoP applications

Design and application of grounded pin-pad resonators in LTCC components

A broadband small‐signal model extraction methodology over 0.2‐220 GHz for bulk FinFETs in RF CMOS technology

Substrate integrated waveguide filter on LCP substrate at 94 GHz

Design of broadband circularly polarized antenna via loading coupled rotated dipoles

Influence of ground-pad dimensions on the performance of vialess transition from coplanar waveguide to microstrip

An improved wideband equivalent circuit model for integrated spiral inductors in CMOS technology

Verification of transmission line de-embedding method for on-chip spiral inductor based on electromagnetic simulation

Microwave-driven thunder materials

A technique to extract extrinsic parameters of HEMTs

Modeling of high-frequency noise of silicon CMOS transistors for RFIC design

Broadband flip‐suspended‐microstrip transition for millimeter‐wave MMIC package

Fabrication of system with probe for high-frequency measurement applications

Hybrid dual-antenna for the 3.6-GHz LTE operation in the tablet computer

A low‐cost broadband millimeter‐wave bias tee network using SICL technology

Modeling the package of a LNA with a 3D-EM simulator

Fully‐integrated active matrix programmable UV and blue micro‐LED display system‐on‐panel (SoP)

Design and fabrication of a small‐form transmitter optical subassembly for 100 Gbps short reach optical interconnect

Submillimeter-wave InP HBT power amplifier using impedance-transforming two-way balun

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