UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Bond-pad damage in ultrasonic wedge bonding

Microelectronics and reliability, 2024-01, Vol.152, p.115279, Article 115279

2024

Volltextzugriff (PDF)

Prediction of pad cratering fracture at the copper pad – Printed circuit board interface

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1454-1463

2012

Volltextzugriff (PDF)

Chip Pad Inspection Method Based on an Improved YOLOv5 Algorithm

Sensors (Basel, Switzerland), 2022-09, Vol.22 (17), p.6685

2022

Volltextzugriff (PDF)

A numerical study on slurry flow with CMP pad grooves

Microelectronic engineering, 2020-10, Vol.234, p.111437, Article 111437

2020

Volltextzugriff (PDF)

A PAD-Based Unmanned Aerial Vehichle Route Planning Scheme for Remote Sensing in Huge Regions

Sensors (Basel, Switzerland), 2023-12, Vol.23 (24), p.9897

2023

Volltextzugriff (PDF)

Defect Identification Method for Transformer End Pad Falling Based on Acoustic Stability Feature Analysis

Sensors (Basel, Switzerland), 2023-03, Vol.23 (6), p.3258

2023

Volltextzugriff (PDF)

Precision Landing Tests of Tethered Multicopter and VTOL UAV on Moving Landing Pad on a Lake

Sensors (Basel, Switzerland), 2023-02, Vol.23 (4), p.2016

2023

Volltextzugriff (PDF)

Study on the Strength of the Brake Pad of a Freight Wagon under Uneven Loading in Operation

Sensors (Basel, Switzerland), 2024-01, Vol.24 (2), p.463

2024

Volltextzugriff (PDF)

Flow Control in Porous Media: From Numerical Analysis to Quantitative μPAD for Ionic Strength Measurements

Sensors (Basel, Switzerland), 2021-05, Vol.21 (10), p.3328

2021

Volltextzugriff (PDF)

Fabrication and Characterization of a Flexible Fluxgate Sensor with Pad-Printed Solenoid Coils

Sensors (Basel, Switzerland), 2020-04, Vol.20 (8), p.2275

2020

Volltextzugriff (PDF)

Performance on lapping quartz glass by UV curing fixed abrasive pad with Gr2O3-diamond composite abrasives

Materials science in semiconductor processing, 2024-01, Vol.169, p.107926, Article 107926

2024

Volltextzugriff (PDF)

Preliminary Characterization of an Active CMOS Pad Detector for Tracking and Dosimetry in HDR Brachytherapy

Sensors (Basel, Switzerland), 2024-01, Vol.24 (2), p.692

2024

Volltextzugriff (PDF)

Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

Sensors (Basel, Switzerland), 2021-10, Vol.21 (20), p.6802

2021

Volltextzugriff (PDF)

A Finger Grip Force Sensor with an Open-Pad Structure for Glove-Type Assistive Devices

Sensors (Basel, Switzerland), 2019-12, Vol.20 (1), p.4

2019

Volltextzugriff (PDF)

Multipurpose Polymer Bragg Grating-Based Optomechanical Sensor Pad

Sensors (Basel, Switzerland), 2019-09, Vol.19 (19), p.4101

2019

Volltextzugriff (PDF)

A Wearable Head Mounted Display Bio-Signals Pad System for Emotion Recognition

Sensors (Basel, Switzerland), 2021-12, Vol.22 (1), p.142

2021

Volltextzugriff (PDF)

Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm

Journal of electronic materials, 2024-08, Vol.53 (8), p.4421-4431

2024

Volltextzugriff (PDF)

The investigation of the signal radiation mechanism of different GSG‐pads connection methods

International journal of numerical modelling, 2023-01, Vol.36 (1), p.n/a

2023

Volltextzugriff (PDF)

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Microelectronics and reliability, 2022-11, Vol.138, p.114716, Article 114716

2022

Volltextzugriff (PDF)

Methodology for pad conditioning sweep optimization for advanced nodes

Microelectronic engineering, 2019-08, Vol.216, p.111101, Article 111101

2019

Volltextzugriff (PDF)

Reliability evaluation of thick Ag wire bonding on Ni pad for power devices

Microelectronics and reliability, 2024-01, Vol.152, p.115304, Article 115304

2024

Volltextzugriff (PDF)

Assessment of Finger Fat Pad Effect on CSRR-Based Sensor Scattering Parameters for Non-Invasive Blood Glucose Level Detection

Sensors (Basel, Switzerland), 2023-01, Vol.23 (1), p.473

2023

Volltextzugriff (PDF)

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Microelectronics and reliability, 2023-12, Vol.151, p.115240, Article 115240

2023

Volltextzugriff (PDF)

Development of an emulator of the sustainable energy harvesting pad system on a bike lane for charging lithium batteries

Microelectronic engineering, 2024-11, Vol.294, p.112262, Article 112262

2024

Volltextzugriff (PDF)

A Comprehensive Approach for Detecting Brake Pad Defects Using Histogram and Wavelet Features with Nested Dichotomy Family Classifiers

Sensors (Basel, Switzerland), 2023-11, Vol.23 (22), p.9093

2023

Volltextzugriff (PDF)

1 – 25 von 10.584

Suche als RSS-Feed

Aktive Filter

KollektionEbook Central Perpetual and DDA

KollektionIEEE Xplore

Zeitschrift / SerieSemiconductor Science And Technology

SpracheSerbian

ThemaEngineering, Electrical & Electronic

ThemaPhysical Sciences

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(9.530)
Mit Volltextzugriff
(9.986)

Publikationsform

Sprache

Englisch
(10.584)
Chinesisch
(2)
Japanisch
(1)

Erscheinungsjahr

n.n

Thema

Engineering
(10.584)
Science & Technology
(10.584)
Technology
(10.584)
Physics
(6.896)
Physics, Applied
(6.754)
Instruments & Instrumentation
(3.904)
Science & Technology - Other Topics
(3.697)
Nanoscience & Nanotechnology
(3.696)
Chemistry
(2.674)
Chemistry, Analytical
(2.664)
Materials Science
(2.497)
Materials Science, Multidisciplinary
(2.365)
Exact Sciences And Technology
(2.120)
Sensors
(1.918)
Applied Sciences
(1.782)
Electronics
(1.754)
Optics
(1.354)
Instrumentation
(1.335)

13 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(13)
... seit 90 Tagen
(110)

Menü

Weitere Dienste

Einstellungen

Bond-pad damage in ultrasonic wedge bonding

Prediction of pad cratering fracture at the copper pad – Printed circuit board interface

Chip Pad Inspection Method Based on an Improved YOLOv5 Algorithm

A numerical study on slurry flow with CMP pad grooves

A PAD-Based Unmanned Aerial Vehichle Route Planning Scheme for Remote Sensing in Huge Regions

Defect Identification Method for Transformer End Pad Falling Based on Acoustic Stability Feature Analysis

Precision Landing Tests of Tethered Multicopter and VTOL UAV on Moving Landing Pad on a Lake

Study on the Strength of the Brake Pad of a Freight Wagon under Uneven Loading in Operation

Flow Control in Porous Media: From Numerical Analysis to Quantitative μPAD for Ionic Strength Measurements

Fabrication and Characterization of a Flexible Fluxgate Sensor with Pad-Printed Solenoid Coils

Performance on lapping quartz glass by UV curing fixed abrasive pad with Gr2O3-diamond composite abrasives

Preliminary Characterization of an Active CMOS Pad Detector for Tracking and Dosimetry in HDR Brachytherapy

Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits

A Finger Grip Force Sensor with an Open-Pad Structure for Glove-Type Assistive Devices

Multipurpose Polymer Bragg Grating-Based Optomechanical Sensor Pad

A Wearable Head Mounted Display Bio-Signals Pad System for Emotion Recognition

Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm

The investigation of the signal radiation mechanism of different GSG‐pads connection methods

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Methodology for pad conditioning sweep optimization for advanced nodes

Reliability evaluation of thick Ag wire bonding on Ni pad for power devices

Assessment of Finger Fat Pad Effect on CSRR-Based Sensor Scattering Parameters for Non-Invasive Blood Glucose Level Detection

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Development of an emulator of the sustainable energy harvesting pad system on a bike lane for charging lithium batteries

A Comprehensive Approach for Detecting Brake Pad Defects Using Histogram and Wavelet Features with Nested Dichotomy Family Classifiers

Aktive Filter

Suchergebnisse filtern