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Highly conductive and smooth surfaced flexible transparent conductive electrode based on silver nanowires

Thin solid films, 2019-09, Vol.685, p.366-371

2019

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Knitted strain sensor with carbon fiber and aluminum-coated yarn, for wearable electronics

Journal of materials chemistry. C, Materials for optical and electronic devices, 2021-12, Vol.9 (46), p.1644-16449

2021

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Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending

Electronic Materials Letters, 2024, 20(2), , pp.122-130

2024

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Crack nucleation during mechanical fatigue in thin metal films on flexible substrates

Acta materialia, 2013-05, Vol.61 (9), p.3473-3481

2013

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Influence of pregnancy on neuromyelitis optica spectrum disorder

Neurology, 2012-04, Vol.78 (16), p.1264-1267

2012

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Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Electronic materials letters, 2018-07, Vol.14 (4), p.387-404

2018

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Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-11, Vol.12 (11), p.1748-1756

2022

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Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates

Journal of materials research, 2014-12, Vol.29 (23), p.2827-2834

2014

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Operation Range-Optimized Silver Nanowire Through Junction Treatment

Electronic Materials Letters, 2020, 16(5), , pp.491-497

2020

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Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Journal of electronic materials, 2019-07, Vol.48 (7), p.4582-4588

2019

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Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array

Small (Weinheim an der Bergstrasse, Germany), 2012-11, Vol.8 (21), p.3300-3306

2012

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Effect of cyclic outer and inner bending on the fatigue behavior of a multi-layer metal film on a polymer substrate

Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S3), p.6-06JF01

2016

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Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate

Journal of materials research, 2018-01, Vol.33 (2), p.138-148

2018

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Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices

Nanotechnology, 2014-03, Vol.25 (12), p.125706-6

2014

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Development of extensive brain lesions following fingolimod (FTY720) treatment in a patient with neuromyelitis optica spectrum disorder

Multiple sclerosis, 2012-01, Vol.18 (1), p.113-115

2012

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In Twisting Motion, Stress‐Free Zone of Wearable Electronics

Advanced electronic materials, 2020-03, Vol.6 (3), p.n/a

2020

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Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Journal of electronic materials, 2009-11, Vol.38 (11), p.2228-2233

2009

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Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Journal of electronic materials, 2010-10, Vol.39 (10), p.2281-2285

2010

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Mirroring with Indocyanine Green Angiography in Aneurysm Surgery: Technical Note and Case Presentations

World neurosurgery, 2019-12, Vol.132, p.e696-e703

2019

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Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

Microelectronic engineering, 2012, Vol.89, p.58-61

2012

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Electrical stimulation promotes functional recovery after spinal cord injury by activating endogenous spinal cord-derived neural stem/progenitor cell: an in vitro and in vivo study

The spine journal, 2024-03, Vol.24 (3), p.534-553

2024

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The usefulness of brain MRI at onset in the differentiation of multiple sclerosis and seropositive neuromyelitis optica spectrum disorders

Multiple sclerosis, 2014-05, Vol.20 (6), p.695-704

2014

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Efficacy and safety of Lenzumestrocel (Neuronata-R® inj.) in patients with amyotrophic lateral sclerosis (ALSUMMIT study): study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

Trials, 2022-05, Vol.23 (1), p.415-415, Article 415

2022

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Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field

Applied physics letters, 2009-07, Vol.95 (3)

2009

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Retrospective 6 month-outcomes and prognostic factors following spontaneous angiogram-negative non-perimesencephalic subarachnoid hemorrhage

Journal of clinical neuroscience, 2022-02, Vol.96, p.12-18

2022

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Highly conductive and smooth surfaced flexible transparent conductive electrode based on silver nanowires

Knitted strain sensor with carbon fiber and aluminum-coated yarn, for wearable electronics

Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending

Crack nucleation during mechanical fatigue in thin metal films on flexible substrates

Influence of pregnancy on neuromyelitis optica spectrum disorder

Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices

Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates

Operation Range-Optimized Silver Nanowire Through Junction Treatment

Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole Array

Effect of cyclic outer and inner bending on the fatigue behavior of a multi-layer metal film on a polymer substrate

Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate

Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devices

Development of extensive brain lesions following fingolimod (FTY720) treatment in a patient with neuromyelitis optica spectrum disorder

In Twisting Motion, Stress‐Free Zone of Wearable Electronics

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Mirroring with Indocyanine Green Angiography in Aneurysm Surgery: Technical Note and Case Presentations

Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects

Electrical stimulation promotes functional recovery after spinal cord injury by activating endogenous spinal cord-derived neural stem/progenitor cell: an in vitro and in vivo study

The usefulness of brain MRI at onset in the differentiation of multiple sclerosis and seropositive neuromyelitis optica spectrum disorders

Efficacy and safety of Lenzumestrocel (Neuronata-R® inj.) in patients with amyotrophic lateral sclerosis (ALSUMMIT study): study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field

Retrospective 6 month-outcomes and prognostic factors following spontaneous angiogram-negative non-perimesencephalic subarachnoid hemorrhage

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