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Comparison of SiC MOSFET-based and GaN HEMT-based high-efficiency high-power-density 7.2 kW EV battery chargers

IET power electronics, 2018-09, Vol.11 (11), p.1849-1857

2018

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Balun bandpass filter based on multilayer substrate integrated waveguide power divider

Electronics letters, 2012, Vol.48 (10), p.571-573

2012

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Wafer‐scale monolithic hybrid integration of Si‐based IC and III–V epi‐layers—A mass manufacturable approach for active matrix micro‐LED micro‐displays

Journal of the Society for Information Display, 2018-03, Vol.26 (3), p.137-145

2018

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The Road for 2D Semiconductors in the Silicon Age (Adv. Mater. 48/2022)

Advanced materials (Weinheim), 2022-12, Vol.34 (48), p.n/a

2022

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Ultra-wideband bandpass filter using CPW-to-microstrip coupling structure

Electronics letters, 2006, Vol.42 (10), p.586-587

2006

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Unequal dual-frequency Wilkinson power divider including series resistor―inductor― capacitor isolation structure

IET microwaves, antennas & propagation, 2009, Vol.3 (7), p.1079-1085

2009

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Nonresonant detection of terahertz radiation by silicon-on-insulator MOSFETs

Electronics letters, 2005, Vol.41 (7), p.447-449

2005

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Dualband frequency-selective surfaces using substrate-integrated waveguide technology

IET microwaves, antennas & propagation, 2007, Vol.1 (2), p.408-413

2007

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High-power handling capability of low complexity RF-MEMS switch in Ku-band

Electronics letters, 2007, Vol.43 (24), p.1367-1368

2007

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Attaining atomic resolution from in situ data collection at room temperature using counter‐diffusion‐based low‐cost microchips

Acta crystallographica. Section D, Biological crystallography., 2020-08, Vol.76 (8), p.751-758

2020

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Single‐Walled Carbon Nanotubes: Solution‐Processing of High‐Purity Semiconducting Single‐Walled Carbon Nanotubes for Electronics Devices (Adv. Mater. 9/2019)

Advanced materials (Weinheim), 2019-03, Vol.31 (9), p.n/a

2019

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Performance of a noncoherent decoder for spectral amplitude‐coding electronic‐code division multiple access

Microwave and optical technology letters, 2021-01, Vol.63 (1), p.112-120

2021

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P‐13.7: High‐quality OLED Micro‐display aided by PGL‐SCS operator

SID International Symposium Digest of technical papers, 2018-04, Vol.49 (S1), p.750-754

2018

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59‐3: Distinguished Paper: Wafer Scale Hybrid Monolithic Integration of Si‐based IC and III‐V Epilayers ‐ a Mass Manufacturable Approach for Active Matrix micro‐LED Displays

SID International Symposium Digest of technical papers, 2018-05, Vol.49 (1), p.786-789

2018

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Orientation‐Controlled 2D Anisotropic and Isotropic Photon Transport in Co‐crystal Polymorph Microplates

Angewandte Chemie, 2020-03, Vol.132 (11), p.4486-4493

2020

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Active SAW devices on 2DEG heterostructures

Electronics letters, 2004, Vol.40 (21), p.1384-1386

2004

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On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2

Journal of polymer science (2020), 2020-08, Vol.58 (16), p.2248-2258

2020

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37.1: Distinguished Paper: A Novel Blue Phase Liquid Crystal Display Applying Wall-Electrode and High Driving Voltage Circuit

SID International Symposium Digest of technical papers, 2015-06, Vol.46 (1), p.542-544

2015

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The nature, sources, and consequences of firm differences in the early history of the semiconductor industry

Strategic management journal, 2000-10, Vol.21 (10-11), p.1017-1041

2000

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4.2: Study of ACF Bonding Technology in Flexible Display Module Packages

SID International Symposium Digest of technical papers, 2015-06, Vol.46 (1), p.12-15

2015

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7-1: Distinguished Paper: 13.3-inch 8k4k 664-ppi 120-Hz 12-bit OLED Display Using Top-Gate Self-Align CAAC-OS FETs and 12-bit Source Driver IC

SID International Symposium Digest of technical papers, 2016-05, Vol.47 (1), p.53-56

2016

Volltextzugriff (PDF)

CMOS exponential current-to-voltage converter

Electronics letters, 1997, Vol.33 (12), p.998

1997

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Strategy and circumstance: the response of American firms to Japanese competition in semiconductors, 1980-1995

Strategic management journal, 2000-10, Vol.21 (10-11), p.1163-1173

2000

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High-speed divide-by-4/5 counter for a dual-modulus prescaler

Electronics letters, 1997, Vol.33 (20), p.1691

1997

Volltextzugriff (PDF)

High-Q coplanar transmission line resonator of YBa2Cu3O7-x on LaAlO3

Electronics letters, 1989, Vol.25 (21), p.1435-1436

1989

Volltextzugriff (PDF)

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Comparison of SiC MOSFET-based and GaN HEMT-based high-efficiency high-power-density 7.2 kW EV battery chargers

Balun bandpass filter based on multilayer substrate integrated waveguide power divider

Wafer‐scale monolithic hybrid integration of Si‐based IC and III–V epi‐layers—A mass manufacturable approach for active matrix micro‐LED micro‐displays

The Road for 2D Semiconductors in the Silicon Age (Adv. Mater. 48/2022)

Ultra-wideband bandpass filter using CPW-to-microstrip coupling structure

Unequal dual-frequency Wilkinson power divider including series resistor―inductor― capacitor isolation structure

Nonresonant detection of terahertz radiation by silicon-on-insulator MOSFETs

Dualband frequency-selective surfaces using substrate-integrated waveguide technology

High-power handling capability of low complexity RF-MEMS switch in Ku-band

Attaining atomic resolution from in situ data collection at room temperature using counter‐diffusion‐based low‐cost microchips

Single‐Walled Carbon Nanotubes: Solution‐Processing of High‐Purity Semiconducting Single‐Walled Carbon Nanotubes for Electronics Devices (Adv. Mater. 9/2019)

Performance of a noncoherent decoder for spectral amplitude‐coding electronic‐code division multiple access

P‐13.7: High‐quality OLED Micro‐display aided by PGL‐SCS operator

59‐3: Distinguished Paper: Wafer Scale Hybrid Monolithic Integration of Si‐based IC and III‐V Epilayers ‐ a Mass Manufacturable Approach for Active Matrix micro‐LED Displays

Orientation‐Controlled 2D Anisotropic and Isotropic Photon Transport in Co‐crystal Polymorph Microplates

Active SAW devices on 2DEG heterostructures

On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2

37.1: Distinguished Paper: A Novel Blue Phase Liquid Crystal Display Applying Wall-Electrode and High Driving Voltage Circuit

The nature, sources, and consequences of firm differences in the early history of the semiconductor industry

4.2: Study of ACF Bonding Technology in Flexible Display Module Packages

7-1: Distinguished Paper: 13.3-inch 8k4k 664-ppi 120-Hz 12-bit OLED Display Using Top-Gate Self-Align CAAC-OS FETs and 12-bit Source Driver IC

CMOS exponential current-to-voltage converter

Strategy and circumstance: the response of American firms to Japanese competition in semiconductors, 1980-1995

High-speed divide-by-4/5 counter for a dual-modulus prescaler

High-Q coplanar transmission line resonator of YBa2Cu3O7-x on LaAlO3

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