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Details

Autor(en) / Beteiligte
Titel
Catalytic atomic layer deposition of amorphous alumina–silica thin films on carbon microfibers
Ist Teil von
  • Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2024-05, Vol.42 (3)
Ort / Verlag
American Vacuum Society
Erscheinungsjahr
2024
Quelle
American Institute of Physics (AIP) Journals
Beschreibungen/Notizen
  • Deposition of silica-based thin films on carbon microfibers has long been considered a challenge. Indeed, the oxidation-sensitive nature of carbon microfibers over 550 K and their submicron-textured surface does not bode well with the required conformity of deposition best obtained by atomic layer deposition (ALD) and the thermal oxidative conditions associated with common protocols of silica ALD. Nonetheless, the use of a catalytic ALD process allowed for the deposition of amorphous alumina–silica bilayers from 445 K using trimethylaluminium and tris(tert-pentoxy)silanol (TPS). In this study, first undertaken on flat silicon wafers to make use of optical spectroscopies, the interplay between kinetics leading to a dense silica film growth was investigated in relation to the applied operation parameters. A threshold between the film catalyzed growth and the complete outgassing of pentoxy-derived compounds from TPS was found, resulting in a deposition of equivalent growth per cycle of 1.1 nm c−1, at a common ALD rate of 0.3 nm  min−1, with a flat thickness gradient. The deposition on carbon microfiber fabrics was found conformal, albeit with a thickness growth capped below 20 nm, imparted by the microfiber surface texture. STEM-EDX showed a sharp interface of the bilayer with limited carbon diffusion. The conformal and dense deposition of alumina–silica thin films on carbon microfibers holds great potential for further use as refractory oxygen barrier layers.
Sprache
Englisch
Identifikatoren
ISSN: 0734-2101
eISSN: 1520-8559
DOI: 10.1116/6.0003422
Titel-ID: cdi_scitation_primary_10_1116_6_0003422
Format
Schlagworte
Engineering Sciences, Materials

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