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Investigations on the bias temperature stabilities of oxide thin film transistors using In-Ga-Zn-O channels prepared by atomic layer deposition
Ist Teil von
RSC advances, 2018-01, Vol.8 (44), p.2514-252
Ort / Verlag
England: Royal Society of Chemistry
Erscheinungsjahr
2018
Quelle
EZB Electronic Journals Library
Beschreibungen/Notizen
Bias temperature stress stabilities of thin-film transistors (TFTs) using In-Ga-Zn-O (IGZO) channels prepared by the atomic layer deposition process were investigated with varying channel thicknesses (10 and 6 nm). Even when the IGZO channel thickness was reduced to 6 nm, the device exhibited good characteristics with a high saturation mobility of 15.1 cm
2
V
−1
s
−1
and low sub-threshold swing of 0.12 V dec
−1
. Excellent positive and negative bias stress stabilities were also obtained. When positive bias temperature stress (PBTS) stability was tested from 40 to 80 °C for 10
4
s, the threshold voltages (
V
TH
) of the device using the 6 nm-thick IGZO channel shifted negatively, and the
V
TH
shifts increased from −0.5 to −6.9 V with the increasing temperature. Time-dependent PBTS instabilities could be explained by a stretched-exponential equation, representing a charge-trapping mechanism.
Bias temperature stress stabilities of thin-film transistors (TFTs) using In-Ga-Zn-O (IGZO) channels prepared by the atomic layer deposition process were investigated with varying channel thicknesses (10 and 6 nm).