Details

Autor(en) / Beteiligte

• Pristauz, Hugo

Titel

0.1 Cent RFID Chip Assembly?

Ist Teil von

• Circuits Assembly, 2005-11, Vol.16 (11), p.52

Ort / Verlag

San Francisco: Printed Circuit Engineering Association, Inc

Erscheinungsjahr

2005

Quelle

Business Source Ultimate

Beschreibungen/Notizen

• In the manufacturing of RFID tags, a basic distinction exists between direct chip assembly and indirect chip assembly (Figure 2). In direct assembly, the chip's bumps are positioned and placed directly onto the antenna connections by means of flip-chip technology. The key advantage is a lower packaging cost, because this requires fewer process steps and consumes less material. However, despite the large antenna pitch, high throughput rates necessitate negligible indexing timing.