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Details

Autor(en) / Beteiligte
Titel
An overview of the reliability prediction related aspects of high power IGBTs in wind power applications
Ist Teil von
  • Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1903-1907
Ort / Verlag
Kidlington: Elsevier Ltd
Erscheinungsjahr
2011
Link zum Volltext
Quelle
Elsevier ScienceDirect Journals Complete
Beschreibungen/Notizen
  • ► This paper is an overview about the reliability prediction of high power IGBTs. ► The failure mechanisms of wire-bonded and press-pack IGBTs are reviewed. ► The most commonly used lifetime prediction models are reviewed. ► So far most of the reliability research was focused on wire-bonded IGBTs. ► More research is needed about the reliability prediction of press-pack IGBTs. Reliability is becoming more and more important as the size and number of installed Wind Turbines (WTs) increases. Very high reliability is especially important for offshore WTs because the maintenance and repair of such WTs in case of failures can be very expensive. WT manufacturers need to consider the reliability aspect when they design new power converters. By designing the power converter considering the reliability aspect the manufacturer can guarantee that the end product will ensure high availability. This paper represents an overview of the various aspects of reliability prediction of high power Insulated Gate Bipolar Transistors (IGBTs) in the context of wind power applications. At first the latest developments and future predictions about wind energy are briefly discussed. Next the dominant failure mechanisms of high power IGBTs are described and the most commonly used lifetime prediction models are reviewed. Also the concept of Accelerated Life Testing (ALT) is briefly reviewed.

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