Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Ergebnis 4 von 172
IEEE transactions on electron devices, 2007-08, Vol.54 (8), p.2002-2010
2007
Volltextzugriff (PDF)

Details

Autor(en) / Beteiligte
Titel
Transient-Induced Latchup Dependence on Power-Pin Damping Frequency and Damping Factor in CMOS Integrated Circuits
Ist Teil von
  • IEEE transactions on electron devices, 2007-08, Vol.54 (8), p.2002-2010
Ort / Verlag
New York, NY: IEEE
Erscheinungsjahr
2007
Quelle
IEEE Xplore Digital Library
Beschreibungen/Notizen
  • The bipolar (underdamped sinusoidal) transient noise on power pins of CMOS integrated circuits (ICs) can trigger latchup in CMOS ICs under system-level electrostatic-discharge test. Two dominant parameters of bipolar transient noise-damping frequency and damping factor-strongly depend on system shielding, board-level noise filter, chip-/board-level layout, etc. The transient-induced-latchup (TLU) dependence on power-pin damping frequency and damping factor was characterized by device simulation and verified by experimental measurement. From the simulation results, bipolar-trigger waveforms with damping frequencies of several tens of megahertz can trigger the TLU most easily. However, TLU is less sensitive to the bipolar-trigger waveforms with an excessively large damping factor or an excessively low/high damping frequency. The simulation results have been experimentally verified with the silicon-controlled-rectifier (SCR) test structures that are fabricated in a 0.25-mum CMOS technology.

Weiterführende Literatur

Empfehlungen zum selben Thema automatisch vorgeschlagen von bX