Microelectronic engineering, 2011-08, Vol.88 (8), p.2275-2277
2011
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Details
- Autor(en) / Beteiligte
- Titel
- Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns
- Ist Teil von
- Microelectronic engineering, 2011-08, Vol.88 (8), p.2275-2277
- Ort / Verlag
- Amsterdam: Elsevier B.V
- Erscheinungsjahr
- 2011
- Quelle
- Alma/SFX Local Collection
- Beschreibungen/Notizen
- In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50μm were formed on wafers by means of screen-printing. The bonding process was carried out at 300°C under reduced pressure, 1×10−3mbar. The bonded wafers were diced into 5mm×5mm individual chips. The bond strength of each chips was about 20MPa measured by a tensile test and about 40MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.
- Sprache
- Englisch
- Identifikatoren
- ISSN: 0167-9317eISSN: 1873-5568DOI: 10.1016/j.mee.2011.02.083Titel-ID: cdi_proquest_miscellaneous_901671531
- Format
- –
- Schlagworte
- Applied sciences, Au bonding, Bonding, Bonding strength, Chips, Design. Technologies. Operation analysis. Testing, Elasticity. Plasticity, Electronics, Exact sciences and technology, Gold, Integrated circuits, Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology, MEMS, Metals. Metallurgy, Micro- and nanoelectromechanical devices (mems/nems), Microelectronic fabrication (materials and surfaces technology), Packaging, Screen printing, Seals, Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices, Shear tests, Wafer bonding, Wafers