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Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies
Ist Teil von
Journal of electronic materials, 2009-02, Vol.38 (2), p.292-302
Ort / Verlag
Boston: Springer US
Erscheinungsjahr
2009
Link zum Volltext
Quelle
Alma/SFX Local Collection
Beschreibungen/Notizen
The results of an intensive reliability study on Pb-free ball grid array (BGA)/Sn-Pb solder assemblies as well as some lessons learnt dealing with mixed assembly production at Celestica are described in this paper. In the reliability study, four types of Pb-free ball grid array components were assembled on test vehicles using the Sn-Pb eutectic solder and typical Sn-Pb reflow profiles with 205°C to 220°C peak temperatures. Accelerated thermal cycling (ATC) was conducted at 0°C to 100°C. The influence of the microstructure on Weibull plot parameters and the failure mode will be shown. Interconnect defects such as nonuniform phase distribution, low-melting structure accumulation, and void formation are discussed. Recommendations on mixed assembly and rework parameters are given.