Details

Autor(en) / Beteiligte

• Martorano, K.M.
• Martorano, M.A.
• Brandi, S.D.

Titel

Optimal conditions for the wetting balance test

Ist Teil von

• Journal of materials processing technology, 2009-03, Vol.209 (6), p.3089-3095

Ort / Verlag

Elsevier B.V

Erscheinungsjahr

2009

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape relative to that of a standard curve, preventing calculation of important wetting parameters, such as the wetting rate and the wetting force. The wetting tests showed that the distortion increased for a thicker sheet thickness and a lower solder bath temperature, being the result of solder bath solidification around the submerged sheet substrate.