Details

Autor(en) / Beteiligte

• SHARPE, W. N
• PULSKAMP, J
• GIANOLA, D. S
• EBERL, C
• POLCAWICH, R. G
• THOMPSON, R. J

Titel

Strain measurements of silicon dioxide microspecimens by digital imaging processing

Ist Teil von

• Experimental mechanics, 2007-10, Vol.47 (5), p.649-658

Ort / Verlag

Heidelberg: Springer

Erscheinungsjahr

2007

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Silicon dioxide thin film is a common component in electronic devices and in MEMS, but its mechanical properties have rarely been studied. Techniques have been adapted and developed to conduct tensile tests on 1.0 mum thick silicon dioxide specimens that are 100, 150, and 200 mum wide and either 1 or 2 mm long. One end of the specimen remains fastened to the substrate, and the other is glued to a silicon carbide fiber attached to a 30 g load cell mounted on a piezoelectric translation stage. Strain is measured by digital imaging of two gold lines applied to the gage section of the transparent specimen. Twenty-five tests yield a Young's modulus of 60.1+/-3.4 GPa and a fracture strength of 364+/-57 MPa.