Details

Autor(en) / Beteiligte

• Huang, H.
• Winchester, K.J.
• Suvorova, A.
• Lawn, B.R.
• Liu, Y.
• Hu, X.Z.
• Dell, J.M.
• Faraone, L.

Titel

Effect of deposition conditions on mechanical properties of low-temperature PECVD silicon nitride films

Ist Teil von

• Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-11, Vol.435, p.453-459

Ort / Verlag

Elsevier B.V

Erscheinungsjahr

2006

Quelle

Access via ScienceDirect (Elsevier)

Beschreibungen/Notizen

• The effect of deposition conditions on characteristic mechanical properties – elastic modulus and hardness – of low-temperature PECVD silicon nitrides is investigated using nanoindentation. It is found that increase in substrate temperature, increase in plasma power and decrease in chamber gas pressure all result in increases in elastic modulus and hardness. Strong correlations between the mechanical properties and film density are demonstrated. The silicon nitride density in turn is shown to be related to the chemical composition of the films, particularly the silicon/nitrogen ratio.