Details

Autor(en) / Beteiligte

• Jung, S.J.
• Kim, K.N.
• Yeom, G.Y.

Titel

Low impedance antenna arrangement of internal linear ICP source for large area FPD processing

Ist Teil von

• Thin solid films, 2006-05, Vol.506 (Complete), p.460-463

Ort / Verlag

Elsevier B.V

Erscheinungsjahr

2006

Quelle

Elsevier ScienceDirect Journals

Beschreibungen/Notizen

• In this study, two different types of internal linear antennas were compared and their characteristics were investigated for a large area ICPs applied to FPD processing. The measured plasma density for the double comb-type antenna was higher than 2 × 10 11/cm 3 and the etch rates of photoresist and SiO 2 at 5000 W rf power, − 60 V of dc-bias voltage, and 15 mTorr SF 6 were about 3000 Å/min and 1500 Å/min. The etch non-uniformity of the photoresist within the substrate was about 7% at 5000 W of rf power.