Details

Autor(en) / Beteiligte

• Odgerel, Zunduijamts
• Kwak, Sang Won
• Ha, Jung-Hong
• Gambarini, Gianluca
• Shen, Ya
• Kim, Hyeon-Cheol

Titel

Effect of MT Technology of Heat Treatment on Reciproc: Comparison of Reciproc, Reciproc Blue, and Reciproc MT

Ist Teil von

• Journal of endodontics, 2024-04, Vol.50 (4), p.520-526

Ort / Verlag

United States: Elsevier Inc

Erscheinungsjahr

2024

Quelle

MEDLINE

Beschreibungen/Notizen

• This study aimed to evaluate the effects from the memory-triple (MT) heat treatment on the fatigue resistance of the Reciproc by comparison with the file systems of same geometry. Reciproc files subjected to MT heat treatment technology were designated as Group RMT and were compared with the original Reciproc (Group REC) and Reciproc Blue (Group REB). Each NiTi file from 3 groups (n = 15) was operated reciprocally with a repetitive up-and-down movement in the curved canal with 4 mm of pecking distance inside of the simulated canal at body temperature. When each file fractured, the time until fracture was recorded. The length of the fractured fragment was measured. Fractured fragments were observed under scanning electron microscope (SEM) to evaluate the topographic features of the surface. Differential scanning calorimetry (DSC) analysis was performed to estimate phase transformation temperatures. One-way analysis of variance and Duncan post hoc comparison were applied to compare among the groups at a significance level of 95%. RMT showed significantly higher fracture resistance (P < .05), whereas there was no difference in fatigue resistance between REC and REB. SEM examination showed the files from the 3 groups had similar topographic features. RMT showed a peak of austenite peak (Ap) at a temperature (52°C) higher than body temperature, whereas REC and REB showed Ap at 37 and 32°C, respectively. Under the condition of this study, the new heat treatment technique of MT technology could enhance the fatigue fracture resistance of the reciprocating files made of M-wire and Blue-wire.