Details

Autor(en) / Beteiligte

• Shao, Xiaodong
• Chen, Zenan
• Yu, Junxiao
• Lu, Fangzhou
• Chen, Shisheng
• Xu, Jingfeng
• Yao, Yihao
• Liu, Bin
• Yang, Ping
• Jiang, Qin
• Hu, Benhui

Titel

Ultralow-cost piezoelectric sensor constructed by thermal compression bonding for long-term biomechanical signal monitoring in chronic mental disorders

Ist Teil von

• Nanoscale, 2024-02, Vol.16 (6), p.2974-2982

Ort / Verlag

England: Royal Society of Chemistry

Erscheinungsjahr

2024

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Wearable bioelectronic devices, which circumvent issues related to the large size and high cost of clinical equipment, have emerged as powerful tools for the auxiliary diagnosis and long-term monitoring of chronic psychiatric diseases. Current devices often integrate multiple intricate and expensive devices to ensure accurate diagnosis. However, their high cost and complexity hinder widespread clinical application and long-term user compliance. Herein, we developed an ultralow-cost poly(vinylidene fluoride)/zinc oxide nanofiber film-based piezoelectric sensor in a thermal compression bonding process. Our piezoelectric sensor exhibits remarkable sensitivity (13.4 mV N −1 ), rapid response (8 ms), and exceptional stability over 2000 compression/release cycles, all at a negligibly low fabrication cost. We demonstrate that pulse wave, blink, and speech signals can be acquired by the sensor, proposing a single biomechanical modality to monitor multiple physiological traits associated with bipolar disorder. This ultralow-cost and mass-producible piezoelectric sensor paves the way for extensive long-term monitoring and immediate feedback for bipolar disorder management. This work constructs a thermal compression bonding piezoelectric sensor (TCBPS) for long-term biomechanical signal monitoring in bipolar disorder.