Details

Autor(en) / Beteiligte

• Sproul, W.D.
• Christie, D.J.
• Carter, D.C.
• Tomasel, F.
• Linz, T.

Titel

Pulsed Plasmas For Sputtering Applications

Ist Teil von

• Surface engineering, 2004-06, Vol.20 (3), p.174-176

Ort / Verlag

London, England: Taylor & Francis

Erscheinungsjahr

2004

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• Pulsed plasmas for sputtering applications have increased in popularity in the past few years. Recently, a new pulsed plasma technique has been introduced to the sputtering world. High power pulsed magnetron sputtering (HPPMS) applies a very large power pulse (up to several megawatts) to the target in a short period of time, which results in a high degree of ionisation of the sputtered species. The ionised species can be used to improve the structure and properties of the deposited film. An experimental power supply was designed and built to learn more about HPPMS. It can produce pulses with peak powers of ≤3 MW with a pulse width of 100-150 μs. The repetition rate for the pulse is from single shot to 500 Hz, and the average delivered power is ≤20 kW. Evidence of the ionisation of the sputtered species is shown with time resolved optical spectroscopy of the plasma. The degree of ionisation is a function of the power. Deposition of very thin, very high density (2.7 g cm 3 ) carbon films by HPPMS is reported. An enabling feature of the power supply is that it can detect and suppress arcs. In addition, the pulsing power supply circuitry prevents the initiation of the arc state in normal operation. At the beginning of the pulse, it transitions directly from the glow to the highly ionised state without accessing the arc regime. SE/500