Details

Autor(en) / Beteiligte

• Ji, Vincent
• Ma, S.L.
• Li, J.B.
• Qin, M.
• Xu, Ke Wei
• Xu, Jiu Hua

Titel

Yield Strength Determination of TiN Film by In-Situ XRD Stress Analysis Method

Ist Teil von

• Materials science forum, 2002-08, Vol.404-407, p.671-676

Ort / Verlag

Aedermannsdorf: Trans Tech Publications Ltd

Erscheinungsjahr

2002

Quelle

Alma/SFX Local Collection

Beschreibungen/Notizen

• By X-ray stress analysis technique, a new approach has been applied to determining the yield strength of polycrystalline TiN film with biaxial residual stress adherent to metal substrate. By plasma-assisted chemical vapor deposition (PACVD), TiN film was deposited on a strip of spring steel 60Mn allowing the film to be subjected to tensile stress under loading of the film/substrate. The film thickness is 2.5 mu m and the steel substrate thickness is 1.1 mm. Longitudinal and transverse stresses, sigma sub 1 and sigma sub 2 of the film were measured in situ by X-ray diffraction. On the basis of the experimental results, the effective stress sigma and the effective uniaxial strain epsilon sub t were obtained. According to the sigma - epsilon sub t relation, the calculated proof stresses, sigma sub 0.1 , and sigma sub 0.2 , of TiN film are 4.2 GPa and 4.4 GPa, respectively.