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Thermal conductivity of β-Si3N4 : I, Effects of various microstructural factors
Ist Teil von
Journal of the American Ceramic Society, 1999-11, Vol.82 (11), p.3105-3112
Ort / Verlag
Malden,MA: Blackwell
Erscheinungsjahr
1999
Quelle
Wiley Online Library All Journals
Beschreibungen/Notizen
Calculations based on a simple modified Wiener's model for thermal conductivity of a composite material predict that the thermal conductivity of beta-Si3N4 decreases quickly as the grain-boundary film thickness increases within a range of a few tenths of a nanometer and also that it initially increases steeply with increased grain size, then reaches almost constant values. Because of the faceted nature of the beta-Si3N4 crystal, the average grain-boundary film thickness is much greater than that in equilibrium. The present study demonstrates both theoretically and experimentally that grain growth alone cannot improve the thermal conductivity of beta-Si3N4. (Author)