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Characteristics of tantalum pentoxide dielectric films deposited on silicon by excimer-lamp assisted photo-induced CVD using an injection liquid source
We report the physical and electrical characteristics of the first tantalu pentoxide dielectric films as deposited by the new technique of low pressure ultraviolet-assisted injection liquid source (UVILS) chemical vapour deposition (UVILS-CVD) using the precursor tantalum tetraethoxy dimethylaminoethoxide (Ta(OEt)
4(dmae)). The films as deposited exhibit high leakage currents due to carbon impurities. Significant porosity is found at deposition temperatures below 350°C. Conventional CV characteristics are exhibited by thick (200 Å to 1000 Å) as-deposited films, with dielectric constants of 17.4 to 24.